Infineon SIPMOS Type P-Channel MOSFET, 330 mA, 60 V Enhancement, 3-Pin SOT-23 BSS83PH6327XTSA1

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Verpakkingsopties
RS-stocknr.:
753-2857
Fabrikantnummer:
BSS83PH6327XTSA1
Fabrikant:
Infineon
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Merk

Infineon

Product Type

MOSFET

Channel Type

Type P

Maximum Continuous Drain Current Id

330mA

Maximum Drain Source Voltage Vds

60V

Package Type

SOT-23

Series

SIPMOS

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

Channel Mode

Enhancement

Forward Voltage Vf

-1.1V

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

360mW

Typical Gate Charge Qg @ Vgs

2.38nC

Maximum Operating Temperature

150°C

Height

1mm

Length

2.9mm

Standards/Approvals

No

Automotive Standard

AEC-Q101

Infineon SIPMOS Series MOSFET, 60V Maximum Drain Source Voltage, 3Ω Maximum Drain Source Resistance - BSS83PH6327XTSA1


This p-channel MOSFET is a surface-mount switching transistor designed for compact power-control roles in electronic assemblies. It operates as an enhancement-mode device suitable for low-current switching in systems that demand a wide operating temperature range and compatibility with automotive-grade requirements.

Features and Benefits:


• 60V drain-source rating enables higher-voltage switching applications
• 3Ω maximum Rds reduces conduction losses during on-state
• 330mA continuous drain current supports small-signal switching
• 2.38nC typical gate charge yields faster gate transitions
• 20V maximum gate-source voltage allows flexible gate drive levels
• AEC-Q101 qualification ensures suitability for automotive electronics

Applications


• Suitable for battery-management and load-disconnect circuits
• Ideal for signal switching in automotive sensor interfaces
• Used with low-power regulator and power-rail switching stages
• Can be used for polarity-reverse protection in compact devices
• Suitable for surface-mount prototypes and dense PCB layouts

What thermal extremes can the device tolerate in real-world use?


It is specified to operate from -55°C up to 150°C, enabling use in both cold-start and high-temperature environments without derating of basic functionality.

How does the package influence board-level assembly and layout?


The SOT-23 surface-mount package is compact and suited to automated placement, permitting tight component spacing and simplified thermal conduction to the PCB.

What power dissipation should designers expect under normal conditions?


The device has a maximum power dissipation of 360mW, which should be accounted for in thermal calculations and thermal pad design to prevent overheating.

How does the component’s gate charge affect switching performance?


A typical gate charge of 2.38nC minimises required gate-drive energy, improving switching speed and reducing driver current for low-frequency or pulse applications.

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