Murata 1μF MLCC, 6.3V dc V, ±10% , SMD
- RS-stocknr.:
- 185-3187
- Fabrikantnummer:
- GMD155R60J105KE11D
- Fabrikant:
- Murata
Subtotaal (1 rol van 10000 eenheden)*
€ 2.550,00
(excl. BTW)
€ 3.090,00
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 03 april 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk | Per rol* |
|---|---|---|
| 10000 + | € 0,255 | € 2.550,00 |
*prijsindicatie
- RS-stocknr.:
- 185-3187
- Fabrikantnummer:
- GMD155R60J105KE11D
- Fabrikant:
- Murata
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Murata | |
| Capacitance | 1µF | |
| Voltage | 6.3V dc | |
| Package/Case | 0402 (1005M) | |
| Mounting Type | Surface Mount | |
| Dielectric | X5R | |
| Tolerance | ±10% | |
| Dimensions | 1 x 0.5 x 0.5mm | |
| Length | 1mm | |
| Depth | 0.5mm | |
| Height | 0.5mm | |
| Series | GMD | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | +85°C | |
| Terminal Type | Solder | |
| Alles selecteren | ||
|---|---|---|
Merk Murata | ||
Capacitance 1µF | ||
Voltage 6.3V dc | ||
Package/Case 0402 (1005M) | ||
Mounting Type Surface Mount | ||
Dielectric X5R | ||
Tolerance ±10% | ||
Dimensions 1 x 0.5 x 0.5mm | ||
Length 1mm | ||
Depth 0.5mm | ||
Height 0.5mm | ||
Series GMD | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature +85°C | ||
Terminal Type Solder | ||
- Land van herkomst:
- JP
These capacitors have gold-plated electrodes and are designed specifically for wire bonding and use of gold-tin (AuSn) solder.
Designed specifically for wire bonding and use of gold-tin (AuSn) solder
The gold-plated external electrodes make these devices suitable for wire bonding or use of gold tin (AuSn) solder
Ideal for mounting in packages, such as optical communication related devices , IC and etc
Noise can be reduced by eliminating the routing of the wire, and high efficiency can be achieved with a built-in capacitor in the package, such as TO-CAN, IC and etc. by wire bonding mounting
Contributes to the miniaturization of the set
Murata offers a lineup of small size products, such as the 0603 (0201) and 1005 (0402) in mm (inch)
Applications
Various device related,such as GaAsIC (mounted in IC packages)
The gold-plated external electrodes make these devices suitable for wire bonding or use of gold tin (AuSn) solder
Ideal for mounting in packages, such as optical communication related devices , IC and etc
Noise can be reduced by eliminating the routing of the wire, and high efficiency can be achieved with a built-in capacitor in the package, such as TO-CAN, IC and etc. by wire bonding mounting
Contributes to the miniaturization of the set
Murata offers a lineup of small size products, such as the 0603 (0201) and 1005 (0402) in mm (inch)
Applications
Various device related,such as GaAsIC (mounted in IC packages)
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