BGAP2S20AE6327XTSA1 Infineon, RF Amplifier, 34.8 dB 2.7 GHz, 16-Pin PG-TSNP-16-12
- RS-stocknr.:
- 349-418
- Fabrikantnummer:
- BGAP2S20AE6327XTSA1
- Fabrikant:
- Infineon
Bulkkorting beschikbaar
Subtotaal (1 eenheid)*
€ 7,10
(excl. BTW)
€ 8,59
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 10 november 2027
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk |
|---|---|
| 1 - 9 | € 7,10 |
| 10 - 99 | € 6,39 |
| 100 - 499 | € 5,88 |
| 500 - 999 | € 5,46 |
| 1000 + | € 4,89 |
*prijsindicatie
- RS-stocknr.:
- 349-418
- Fabrikantnummer:
- BGAP2S20AE6327XTSA1
- Fabrikant:
- Infineon
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Infineon | |
| Typical 3dB Bandwidth | 2300 → 2700MHz | |
| Typical Power Gain | 34.8 dB | |
| Typical Output Power | 28.9dBm | |
| Typical Noise Figure | 3.8dB | |
| Number of Channels per Chip | 1 | |
| Maximum Operating Frequency | 2.7 GHz | |
| Package Type | PG-TSNP-16-12 | |
| Pin Count | 16 | |
| Alles selecteren | ||
|---|---|---|
Merk Infineon | ||
Typical 3dB Bandwidth 2300 → 2700MHz | ||
Typical Power Gain 34.8 dB | ||
Typical Output Power 28.9dBm | ||
Typical Noise Figure 3.8dB | ||
Number of Channels per Chip 1 | ||
Maximum Operating Frequency 2.7 GHz | ||
Package Type PG-TSNP-16-12 | ||
Pin Count 16 | ||
- Land van herkomst:
- MY
The Infineon 2.3 to 2.7 GHz low-band driver amplifier that can be used as pre-driver or driver in RF applications from massive MIMO 5G base stations to small cells and access points. The driver amplifier is typically placed between transceiver IC and power amplifier but can also be used as power amplifier for low power applications. The input and outputs are single-ended and internally matched to 50 Ω.
BiCMOS technology for an optimized performance
High gain and high power for fewer components in line up
Internal matching and saving external matching components
Easy design in and small area footprint
High gain and high power for fewer components in line up
Internal matching and saving external matching components
Easy design in and small area footprint
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