TE Connectivity Z-PACK Series Vertical Board PCB Header, 60 Contact(s), 2.5 mm Pitch, 6 Row, Shrouded

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Subtotaal (1 tube van 34 eenheden)*

€ 329,29

(excl. BTW)

€ 398,44

(incl. BTW)

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  • Verzending vanaf 20 januari 2026
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Tube(s)
Per tube
Per stuk*
1 +€ 329,29€ 9,685

*prijsindicatie

RS-stocknr.:
481-019
Fabrikantnummer:
5120678-1
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Series

Z-PACK

Product Type

PCB Header

Current

1.15A

Pitch

2.5mm

Housing Material

Fibreglass Polyester

Number of Contacts

60

Number of Rows

6

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Tin Plated

Contact Material

Phosphor Bronze

Termination Type

Solder

Row Pitch

2.5mm

Minimum Operating Temperature

65°C

Maximum Operating Temperature

105°C

Tail Pin Length

3.7mm

Contact Gender

Male

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, UL 94V-0

Mating Pin Length

6.8mm

Voltage

250 V

Distrelec Product Id

304-50-005

Land van herkomst:
CN
The TE Connectivity 60 Position High Speed Backplane Connector, part of the Z-PACK HS3 series, redefines connectivity solutions. Designed for printed circuit board (PCB) applications, this vertical, partially shrouded header enables efficient signal transmission and robust performance. With 60 positions spread across 6 rows and 5 columns, it accommodates high-density interconnections, simplifying the design while maximising efficiency. Its 2.5 mm centreline facilitates ease of integration into compact spaces, ensuring it meets modern electronic demands. This connector is not just about utility; it’s constructed from materials that provide durability and reliability, making it suitable for varied environments, from standard to extreme temperatures. Enhance your PCB projects with a truly versatile connector that exhibits both form and function.

Designed to terminate directly to printed circuit boards

Allows for easy integration in traditional backplane architectures

Features a robust dual beam contact shape for reliable connections

Employs a press-fit termination method for secure assembly

Incorporates ESD/HDI guide pin style aiding in precise alignment

Constructed with low halogen materials for enhanced environmental compliance

The compact design aids in reducing PCB real estate whilst ensuring high performance

Flexible operating temperature range making it suitable for diverse applications

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