TE Connectivity Z-PACK HS3 Series Vertical PCB PCB Header, 60 Contact(s), 2.5 mm Pitch, 6 Row, Shrouded

The TE Connectivity high-speed backplane connector is engineered for precision and reliability in demanding applications. With a robust six-row design featuring 60 positions and a partially shrouded vertical PCB mount configuration, this connector ensures secure and efficient connections in limited spaces. The Z-PACK HS3 model is tailored to accommodate traditional backplane architectures, facilitating seamless integration into various electronic systems. Designed for an operating voltage of up to 250 VAC, it delivers exceptional performance while maintaining a compact footprint. The combination of carefully selected materials and advanced engineering results in a connector that not only meets stringent industry standards but also provides low halogen content for reduced environmental impact. This product stands out for its ability to deliver both versatility and efficiency, catering to the evolving demands of modern electronic designs.

Utilises a dual beam contact shape for enhanced electrical performance