TE Connectivity Z-PACK HS3 Series Vertical Board PCB Header, 50 Contact(s), 2.5 mm Pitch, 10 Row, Shrouded

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Subtotaal (1 tube van 40 eenheden)*

€ 731,82

(excl. BTW)

€ 885,50

(incl. BTW)

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  • Verzending vanaf 20 januari 2026
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Tube(s)
Per tube
Per stuk*
1 +€ 731,82€ 18,296

*prijsindicatie

RS-stocknr.:
471-921
Fabrikantnummer:
5120747-2
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Series

Z-PACK HS3

Product Type

PCB Header

Pitch

2.5mm

Current

1.15A

Housing Material

Fibreglass Polyester

Number of Contacts

50

Number of Rows

10

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Tin Plated

Termination Type

Solder

Row Pitch

2.5mm

Minimum Operating Temperature

65°C

Tail Pin Length

3.7mm

Maximum Operating Temperature

105°C

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC, EU RoHS Directive 2011/65/EU, UL 94V-0

Mating Pin Length

6.8mm

Voltage

250 V

Distrelec Product Id

304-50-007

Land van herkomst:
CN
The TE Connectivity 50 Position High Speed Backplane Connector is a meticulously engineered solution designed for exceptional performance in demanding electronic applications. This connector features a vertical PCB mount header configuration, offering unparalleled space efficiency while maintaining robust connectivity. It is part of the Z-PACK HS3 series, known for its reliability and high-speed characteristics. With 10 rows and 5 columns of meticulously arranged contact pins, this connector ensures optimal signal integrity and maintains a compact footprint. It is designed to excel in a diverse range of environments, operating efficiently in temperatures ranging from -65 to 105 °C. The partially shrouded design not only enhances mating reliability but also simplifies installation, making it an ideal choice for modern high-speed backplane systems. This connector meets stringent industry standards for quality and safety, ensuring peace of mind in critical applications.

Designed for high-speed applications, ensuring minimal signal degradation

Vertical orientation provides efficient use of space in compact assemblies

Polarisation feature simplifies mating and enhances engagement reliability

Constructed with a rugged polyester housing for long-lasting performance

Nickel contact underplating ensures excellent conductivity and durability

Compatible with industry-standard PCB thickness for effortless integration

Low-halogen materials support environmental compliance for sustainable manufacturing

Rounded contact design optimises mating and reduces wear over time

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