Infineon Dual OptiMOS 1 Type P, Type N-Channel MOSFET Arrays, 2.3 A, 30 V Enhancement, 6-Pin TSOP BSL308CH6327XTSA1

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RS-stocknr.:
214-4334
Fabrikantnummer:
BSL308CH6327XTSA1
Fabrikant:
Infineon
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Merk

Infineon

Channel Type

Type P, Type N

Product Type

MOSFET Arrays

Maximum Continuous Drain Current Id

2.3A

Maximum Drain Source Voltage Vds

30V

Series

OptiMOS

Package Type

TSOP

Mount Type

Surface

Pin Count

6

Maximum Drain Source Resistance Rds

57mΩ

Channel Mode

Enhancement

Maximum Gate Source Voltage Vgs

20V

Forward Voltage Vf

1.1V

Maximum Power Dissipation Pd

0.6W

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

-5nC

Transistor Configuration

Dual

Maximum Operating Temperature

150°C

Length

2.9mm

Width

1.6mm

Standards/Approvals

IEC61249-2-21, RoHS

Height

1mm

Number of Elements per Chip

1

Automotive Standard

AEC-Q101

Infineon OptiMOS Series MOSFET Arrays, 30V Maximum Drain Source Voltage, 2.3A Maximum Continuous Drain Current - BSL308CH6327XTSA1


This MOSFET array device provides paired P‑channel and N‑channel transistors in a compact surface‑mount package for switching and power-management roles in automotive and industrial electronics. It is supplied in a TSOP 6‑pin format designed for board‑level integration and operation across a wide ambient range, supporting typical gate-charge behaviour suited to rapid switching tasks.

Features and Benefits:


• Low Rds(on) 57mΩ reduces conduction losses and heat generation
• Maximum continuous drain current 2.3A enables moderate load handling
• Maximum Vds 30V supports 30V system architectures
• Maximum gate‑source voltage 20V protects gate integrity under transients
• Forward voltage 1.1V improves efficiency in diode conduction paths
• Rated to 150°C allows reliable operation at elevated junction temperatures

Applications


• Suitable for automotive body control modules requiring AEC compliance
• Ideal for high‑density DC-DC converter switch stages
• Used with battery management circuits in vehicles and equipment
• Can be used for motor driver low‑side or high‑side switching
• Suitable for compact power distribution on surface‑mount PCBs

What mounting type is required for board assembly?


It is a surface‑mount device in a TSOP 6‑pin package intended for reflow soldering to standard PCB land patterns.

How does it behave across temperature extremes?


The device is specified to operate from -55°C up to a maximum of 150°C, allowing use in harsh thermal environments.

Are there separate transistor elements per chip?


There is one element per chip configured as a dual transistor arrangement delivering both P‑ and N‑channel functions.

What standards and material compliance are indicated?


The component is RoHS‑compliant and manufactured using materials conformant with IEC 61249‑2‑21.

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