Infineon SIPMOS Type N-Channel MOSFET, 120 mA, 600 V Enhancement, 4-Pin SOT-223

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  • Verzending vanaf 09 oktober 2026
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RS-stocknr.:
165-5811
Fabrikantnummer:
BSP125H6327XTSA1
Fabrikant:
Infineon
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Merk

Infineon

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

120mA

Maximum Drain Source Voltage Vds

600V

Series

SIPMOS

Package Type

SOT-223

Mount Type

Surface

Pin Count

4

Maximum Drain Source Resistance Rds

45Ω

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

4.4nC

Forward Voltage Vf

0.8V

Maximum Power Dissipation Pd

1.8W

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

150°C

Length

6.5mm

Standards/Approvals

No

Height

1.5mm

Automotive Standard

AEC-Q101

Land van herkomst:
CN

Infineon SIPMOS Series MOSFET, 600V Maximum Drain Source Voltage, 120mA Maximum Continuous Drain Current - BSP125H6327XTSA1


This MOSFET is a high-voltage N-channel switching device designed for surface-mounted power applications in demanding environments. It operates across a wide temperature range and is intended for circuits requiring high drain‑to‑source blocking capability and controlled switching behaviour. The package supports automated PCB assembly and is suited to electronic systems in transportation and industrial contexts.

Features and Benefits:


• 600V drain‑source rating enables high-voltage switching capability
• 45Ω maximum Rds reduces leakage in off-state conditions
• 4.4nC typical gate charge for faster gate transitions
• 120mA continuous drain current for low-current power stages
• 0.8V forward voltage minimises conduction drop in diode path
• 1.8W maximum dissipation supports modest power handling

Applications


• Suitable for automotive high-voltage auxiliary circuits
• Ideal for input-stage switching in power supplies
• Used with industrial sensor interfaces requiring isolation
• Can be used for small motor driver protection elements
• Practical for battery management and charging subsystems

What mounting method is required for board assembly?


It is supplied in a surface-mount SOT-223 style package intended for soldered PCB attachment and reflow processes.

How does it behave across temperature extremes?


Rated to operate from -55°C to 150°C, the device maintains switching function and specified limits throughout that thermal span.

What gate voltage limits should designers observe?


The maximum gate‑to‑source voltage is 20V, so drive circuits must not exceed this amplitude to avoid damage.

Are there constraints on pulse versus continuous current?


The specified continuous drain capability is 120mA

higher transient currents would require thermal and safe‑operating‑area assessment.

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