Molex Micro-Fit Series Right Angle Through Hole PCB Header, 8 Contact(s), 3 mm Pitch, 2 Row, Shrouded
- RS-stocknr.:
- 205-1062
- Fabrikantnummer:
- 212528-0800
- Fabrikant:
- Molex
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- RS-stocknr.:
- 205-1062
- Fabrikantnummer:
- 212528-0800
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
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Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Product Type | PCB Header | |
| Series | Micro-Fit | |
| Current | 12.5A | |
| Pitch | 3mm | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 8 | |
| Number of Rows | 2 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Material | Copper Alloy | |
| Contact Plating | Tin | |
| Minimum Operating Temperature | -40°C | |
| Row Pitch | 3mm | |
| Termination Type | Solder | |
| Contact Gender | Female | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | No | |
| Voltage | 600 V | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Product Type PCB Header | ||
Series Micro-Fit | ||
Current 12.5A | ||
Pitch 3mm | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 8 | ||
Number of Rows 2 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Material Copper Alloy | ||
Contact Plating Tin | ||
Minimum Operating Temperature -40°C | ||
Row Pitch 3mm | ||
Termination Type Solder | ||
Contact Gender Female | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals No | ||
Voltage 600 V | ||
- Land van herkomst:
- CN
The Molex Micro-Fit+ connector is a wire-to-board system which offers a 3.00mm pitch, a higher-current rating of 12.5A and superior design options for flexibility and efficient assembly. It is used in routers, appliances and charging stations.
Fully isolated contacts on each side of the interface
Prevents mis-mating; different than standard Micro-Fit 3.0
Enhanced TPA design
V-0/Glow Wire combination resin
Reflow options available
Reduced Mating Force by 40%
Smaller PCB footprint
Fully polarized housings
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