Molex Micro-Fit Series Right Angle Through Hole PCB Header, 8 Contact(s), 3 mm Pitch, 2 Row, Shrouded
- RS-stocknr.:
- 205-1061
- Fabrikantnummer:
- 212528-0800
- Fabrikant:
- Molex
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- RS-stocknr.:
- 205-1061
- Fabrikantnummer:
- 212528-0800
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Series | Micro-Fit | |
| Product Type | PCB Header | |
| Pitch | 3mm | |
| Current | 12.5A | |
| Number of Contacts | 8 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Rows | 2 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Material | Copper Alloy | |
| Contact Plating | Tin | |
| Termination Type | Solder | |
| Row Pitch | 3mm | |
| Minimum Operating Temperature | -40°C | |
| Contact Gender | Female | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | No | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Series Micro-Fit | ||
Product Type PCB Header | ||
Pitch 3mm | ||
Current 12.5A | ||
Number of Contacts 8 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Rows 2 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Material Copper Alloy | ||
Contact Plating Tin | ||
Termination Type Solder | ||
Row Pitch 3mm | ||
Minimum Operating Temperature -40°C | ||
Contact Gender Female | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals No | ||
- Land van herkomst:
- CN
The Molex Micro-Fit+ connector is a wire-to-board system which offers a 3.00mm pitch, a higher-current rating of 12.5A and superior design options for flexibility and efficient assembly. It is used in routers, appliances and charging stations.
Fully isolated contacts on each side of the interface
Prevents mis-mating; different than standard Micro-Fit 3.0
Enhanced TPA design
V-0/Glow Wire combination resin
Reflow options available
Reduced Mating Force by 40%
Smaller PCB footprint
Fully polarized housings
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