TE Connectivity AMPMODU Series Vertical Surface PCB Header, 70 Contact(s), 1.27 mm Pitch, 2 Row, Shrouded

Subtotaal (1 tube van 18 eenheden)*

€ 237,91

(excl. BTW)

€ 287,87

(incl. BTW)

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  • Verzending vanaf 20 januari 2026
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Tube(s)
Per tube
Per stuk*
1 +€ 237,91€ 13,217

*prijsindicatie

RS-stocknr.:
520-644
Fabrikantnummer:
5-104894-7
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

0.5A

Pitch

1.27mm

Number of Contacts

70

Housing Material

Liquid Crystal Polymer

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Surface

Connector System

Board-to-Board

Contact Material

Brass

Contact Plating

Gold

Minimum Operating Temperature

65°C

Row Pitch

1.27mm

Termination Type

Surface Mount

Maximum Operating Temperature

105°C

Standards/Approvals

UL 94 V-0

Distrelec Product Id

304-54-154

Land van herkomst:
MX
The TE Connectivity PCB mount header is designed for vertical assembly in board-to-board applications, offering a reliable connection for various electronic circuits. Featuring a 70-position configuration and a 1.27 mm centreline, it ensures a compact footprint while maintaining exceptional performance efficiency. The fully shrouded design enhances its robustness, preventing accidental disconnections and providing a secure connection even in high-density designs. Additionally, with gold plating on the contact mating area, it effectively enhances conductivity and resistance against corrosion. This connector is ideal for modern electronic devices requiring high reliability and durability in extreme operating conditions.

Optimised for a parallel board-to-board configuration

Constructed from liquid crystal polymer for excellent thermal stability

Features a standard connector profile for easy integration

The contact shape is round, providing reliable connectivity

Polarisation aids in correct mating alignment during assembly

Meets industry standards with a UL flammability rating of UL 94V-0

Low halogen content ensures a minimal environmental impact

Designed for reflow solder processes, accommodating assembly efficiency

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