TE Connectivity 5-104 Series Vertical Surface PCB Header, 70 Contact(s), 1.27 mm Pitch, 2 Row, Shrouded

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Subtotaal (1 tube van 22 eenheden)*

€ 238,15

(excl. BTW)

€ 288,16

(incl. BTW)

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  • Verzending vanaf 20 januari 2026
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Tube(s)
Per tube
Per stuk*
1 +€ 238,15€ 10,825

*prijsindicatie

RS-stocknr.:
469-790
Fabrikantnummer:
5-104656-7
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Product Type

PCB Header

Series

5-104

Pitch

1.27mm

Current

0.5A

Housing Material

Thermoplastic

Number of Contacts

70

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Surface

Connector System

Board-to-Board

Contact Plating

Gold

Contact Material

Phosphor Bronze

Termination Type

Surface Mount

Row Pitch

1.27mm

Minimum Operating Temperature

65°C

Maximum Operating Temperature

105°C

Contact Gender

Male

Standards/Approvals

CSA LR7189, UL E28476

Voltage

30 V

Distrelec Product Id

304-54-147

Land van herkomst:
MX
The TE Connectivity PCB Mount Header is an innovative solution designed for seamless board-to-board connections. With its sleek vertical orientation and precision-engineered components, this connector ensures reliable performance across a multitude of applications. The 70-position configuration provides ample connectivity options, while the 1.27 mm (.05 in) centreline spacing allows for efficient space utilisation on printed circuit boards. Fully shrouded to enhance stability, this header features gold-plated contacts for superior conductivity and corrosion resistance. Its surface mount orientation and robust thermoplastic housing material guarantee durability, making it an ideal choice for demanding environments. The compatibility with industry standards further strengthens its positioning as a top-notch component for electronic interconnections.

Designed for reliable board-to-board connectivity in compact spaces

Fully shrouded header type enhances mechanical stability

Utilises gold plating for improved electrical performance

Constructed from high-quality thermoplastic for durability

Parallel configuration facilitates optimal electrical performance

Mating alignment is streamlined through keyed design

Low-halogen composition supports environmental standards

Compatible with reflow soldering processes, ensuring ease of assembly

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