TE Connectivity AMP Mini CT Series Right Angle Board PCB Header, 26 Contact(s), 1.5 mm Pitch, 2 Row, Shrouded

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€ 691,87

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€ 837,16

(incl. BTW)

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  • Verzending vanaf 16 februari 2026
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RS-stocknr.:
481-332
Fabrikantnummer:
2-292262-6
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Series

AMP Mini CT

Product Type

PCB Header

Pitch

1.5mm

Current

2A

Housing Material

Nylon Fibreglass

Number of Contacts

26

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Plating

Tin Plated

Contact Material

Brass

Termination Type

Solder

Row Pitch

1.5mm

Minimum Operating Temperature

30°C

Tail Pin Length

3mm

Maximum Operating Temperature

105°C

Standards/Approvals

RoHS

Mating Pin Length

2.9mm

Voltage

50 V

Distrelec Product Id

304-53-819

Land van herkomst:
CN
The TE Connectivity PCB Mount Header is expertly designed for efficient wire-to-board connections. With a right-angle orientation and a robust shrouded structure, this connector seamlessly integrates into compact PCB applications. The 26-position assembly not only caters to various configurations but also ensures reliability and durability in performance. Meeting stringent electrical standards, it operates effectively within a voltage range of 50 VDC. Its unique design facilitates straightforward soldering through its through-hole terminals, enabling easy integration into diverse electronic projects. Tailored for use across multiple industries, this connector promises longevity and excellent signal integrity, making it a vital component in modern circuitry.

Right angle orientation optimises space on PCB layouts

Sealed connectors ensure protection against dust and moisture

Natural housing material offers a lightweight and resilient structure

Polarized design aids in correct mating and assembly

Staggered contact layout enhances performance and reliability

Matte tin plating provides excellent electrical conductivity

Wave solder compatible to facilitate the assembly process

High temperature resistance maintains integrity under various conditions

Large packaging quantity ensures availability for extensive projects

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