TE Connectivity AMP Mini CT Series Vertical Board PCB Header, 32 Contact(s), 1.5 mm Pitch, 2 Row, Shrouded

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€ 854,13

(excl. BTW)

€ 1.033,50

(incl. BTW)

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RS-stocknr.:
476-360
Artikelnummer Distrelec:
304-54-022
Fabrikantnummer:
3-292229-2
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Series

AMP Mini CT

Product Type

PCB Header

Current

2A

Pitch

1.5mm

Housing Material

Nylon Fibreglass

Number of Contacts

32

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Board

Contact Material

Brass

Contact Plating

Tin Plated

Row Pitch

1.5mm

Termination Type

Surface Mount

Minimum Operating Temperature

30°C

Maximum Operating Temperature

105°C

Contact Gender

Male

Mating Pin Length

2.4mm

Standards/Approvals

CSA LR7189, UL E28476

Voltage

50 V

Land van herkomst:
CN
The TE Connectivity PCB Mount Header is engineered to provide a reliable connection for wire-to-board applications. With a vertical design and a robust 32-position configuration, it ensures secure connections for a variety of electronic projects. This fully shrouded connector, featuring a compact 1.5 mm centreline, offers seamless integration into PCB layouts. Composed of high-quality materials, it withstands demanding operational voltages up to 50 VDC, making it ideal for diverse electronic environments. Its user-friendly design facilitates easy assembly and aligns perfectly with modern manufacturing processes, ensuring that the performance and reliability are not compromised. This connector is a dependable choice for signal applications, ensuring durability through its well-thought-out mechanical and electrical characteristics.

Allows for efficient PCB mounting with a vertical orientation

Utilises a fully shrouded design for enhanced safety and protection

Supports a high number of positions accommodating more connections in compact spaces

Incorporates a unique square contact shape for optimal mating

Features a robust housing material that ensures lasting performance under various conditions

Design includes alignment features simplifying the installation process

Meets rigorous standards for compatibility with various industrial applications

Highly effective in reflow soldering processes accommodating modern assembly techniques

Offers excellent retention capabilities to ensure secure connections even in challenging environments

Complies fully with global directives ensuring environmental safety and compliance

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