TE Connectivity 1-87456-9 Series Cable PCB Header, 24 Contact(s), 2.54 mm Pitch, 2 Row

Subtotaal (1 verpakking van 150 eenheden)*

€ 237,86

(excl. BTW)

€ 287,81

(incl. BTW)

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  • Verzending vanaf 26 januari 2026
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RS-stocknr.:
470-108
Fabrikantnummer:
1-87456-9
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Product Type

PCB Header

Series

1-87456-9

Current

3A

Pitch

2.54mm

Number of Contacts

24

Housing Material

Nylon Fibreglass

Number of Rows

2

Mount Type

Cable

Connector System

Wire-to-Board

Contact Plating

Tin

Contact Material

Phosphor Bronze

Minimum Operating Temperature

-65°C

Row Pitch

2.54mm

Termination Type

Crimp

Maximum Operating Temperature

105°C

Standards/Approvals

CSA, RoHS, UL

Voltage

250 V

Distrelec Product Id

304-48-434

Land van herkomst:
US
The TE Connectivity Housing Receptacle is engineered for wire-to-board applications, providing a reliable and efficient solution for connecting 24 positions in a compact design. Designed with a 2.54 mm centreline, this housing excels in delivering optimum connectivity through crimp terminations. Its robust construction in black nylon material ensures durability while maintaining a lightweight profile. This product is ideal for signal applications, making it versatile for various electronic devices. With excellent performance features such as low termination resistance and high insulation resistance, it supports the demands of modern electronic configurations, ensuring stable operations within an extensive operating temperature range.

Delivers exceptional reliability for a wide range of signalling applications

Optimised for a compact design, facilitating easy integration in tight spaces

Low termination resistance enhances overall connectivity performance

Constructed from durable nylon, ensuring long-lasting performance and resilience

Efficient crimp termination method allows for straightforward assembly

Compatible with various components within the AMPMODU IV/V series, ensuring flexibility in usage

Offers insulation resistance capability to support high-demand electronic environments

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