TE Connectivity 3-87456-9 Series PCB PCB Header, 50 Contact(s), 2.54 mm Pitch, 2 Row

Subtotaal (1 verpakking van 50 eenheden)*

€ 214,07

(excl. BTW)

€ 259,02

(incl. BTW)

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  • Verzending vanaf 26 januari 2026
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RS-stocknr.:
469-408
Fabrikantnummer:
3-87456-9
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Product Type

PCB Header

Series

3-87456-9

Current

3A

Pitch

2.54mm

Housing Material

Nylon Fibreglass

Number of Contacts

50

Number of Rows

2

Mount Type

PCB

Connector System

Wire-to-Board

Contact Material

Beryllium Copper Alloy

Termination Type

Crimp

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Maximum Operating Temperature

105°C

Standards/Approvals

CSA LR7189, UL E28476

Voltage

250 V

Distrelec Product Id

304-50-718

Land van herkomst:
US
The TE Connectivity Housing receptacle, designed for wire-to-board applications, embodies the pinnacle of connectivity solutions. With a distinguished structure, it accommodates 50 positions, ensuring streamlined arrangement and effective electronic communication. The product's robust design utilises high-quality nylon reinforced with glass fibre, which not only enhances durability but also serves to maintain performance under a wide range of environmental conditions. Its compact dimensions and efficient crimp termination method provide versatility in various applications, making it an ideal choice for modern electronic assemblies. The connector supports a significant operating temperature range, ensuring reliable functionality whether in harsh or standard environments. Utilising superior beryllium copper contacts, it guarantees maximum conductivity while remaining compliant with stringent industry standards.

Compact design maximises space efficiency in electronic devices

Dual row layout enhances connection density without compromising performance

Manufactured from durable materials ensuring longevity in demanding environments

Easily integrates into various applications for greater design flexibility

Supported by robust electrical characteristics for dependable signal integrity

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