Vishay SUD23N06-31 Type N-Channel MOSFET, 23 A, 60 V Enhancement, 3-Pin TO-252 SUD23N06-31-GE3

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Verpakkingsopties
RS-stocknr.:
636-5397P
Fabrikantnummer:
SUD23N06-31-GE3
Fabrikant:
Vishay
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Merk

Vishay

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

23A

Maximum Drain Source Voltage Vds

60V

Series

SUD23N06-31

Package Type

TO-252

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

31mΩ

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

11nC

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

31.25W

Forward Voltage Vf

1V

Maximum Gate Source Voltage Vgs

20V

Maximum Operating Temperature

150°C

Width

6.22mm

Standards/Approvals

RoHS

Length

6.73mm

Height

2.38mm

Automotive Standard

No

Vishay SUD23N06-31 Series MOSFET, 60V Maximum Drain Source Voltage, 23A Maximum Continuous Drain Current - SUD23N06-31-GE3


This n-channel enhancement MOSFET is a surface-mount power transistor designed for switching and power-management roles in electronic systems. It operates over a wide temperature range and is suitable for applications requiring moderate voltage handling and substantial continuous current capability. The device is supplied in a TO-252 package for straightforward PCB mounting and thermal interfacing.

Features and Benefits:


• 60V drain-source withstand enables medium-voltage switching applications
• 23A continuous drain current supports high-current loads
• 31mΩ low Rds(on) reduces conduction losses during operation
• 11nC typical gate charge yields faster switching with lower drive energy
• 31.25W power dissipation allows handling of significant thermal load

Applications


• Suitable for DC-DC converter switch stages
• Ideal for power distribution in motor drivers
• Used with battery-management and power-rail circuits
• Can be used for LED driver power switches

What gate voltage limits should I observe for reliable operation?


The maximum gate-source voltage is 20V, so gate drivers and bias networks must keep Vgs within that threshold to avoid damage.

How does the device perform across temperature extremes?


It is specified to operate from -55°C up to +150°C, accommodating both cold-start conditions and elevated junction temperatures in demanding environments.

What package considerations affect thermal handling on the PCB?


The TO-252 package provides a thermal path to the board

appropriate copper area and thermal vias under the mounting pad will improve heat dissipation and maintain power capability.

What pin configuration and count does it use for layout planning?


It is a three-pin device, which simplifies footprint design while supporting direct power and gate connections for compact layouts.

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