Infineon IQE Type N-Channel MOSFET, 310 A, 25 V Enhancement, 24-Pin TSDSO IQE006NE2LM5CGSCATMA1
- RS-stocknr.:
- 260-1073
- Fabrikantnummer:
- IQE006NE2LM5CGSCATMA1
- Fabrikant:
- Infineon
Bulkkorting beschikbaar
Subtotaal (1 verpakking van 2 eenheden)*
€ 4,58
(excl. BTW)
€ 5,54
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 90,00
Op voorraad
- 5.950 stuk(s) klaar voor verzending vanaf een andere locatie
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk | Per verpakking* |
|---|---|---|
| 2 - 18 | € 2,29 | € 4,58 |
| 20 - 48 | € 2,04 | € 4,08 |
| 50 - 98 | € 1,925 | € 3,85 |
| 100 - 198 | € 1,79 | € 3,58 |
| 200 + | € 1,65 | € 3,30 |
*prijsindicatie
- RS-stocknr.:
- 260-1073
- Fabrikantnummer:
- IQE006NE2LM5CGSCATMA1
- Fabrikant:
- Infineon
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Infineon | |
| Product Type | MOSFET | |
| Channel Type | Type N | |
| Maximum Continuous Drain Current Id | 310A | |
| Maximum Drain Source Voltage Vds | 25V | |
| Package Type | TSDSO | |
| Series | IQE | |
| Mount Type | Surface | |
| Pin Count | 24 | |
| Channel Mode | Enhancement | |
| Forward Voltage Vf | 1V | |
| Standards/Approvals | No | |
| Automotive Standard | No | |
| Alles selecteren | ||
|---|---|---|
Merk Infineon | ||
Product Type MOSFET | ||
Channel Type Type N | ||
Maximum Continuous Drain Current Id 310A | ||
Maximum Drain Source Voltage Vds 25V | ||
Package Type TSDSO | ||
Series IQE | ||
Mount Type Surface | ||
Pin Count 24 | ||
Channel Mode Enhancement | ||
Forward Voltage Vf 1V | ||
Standards/Approvals No | ||
Automotive Standard No | ||
The Infineon MOSFETs allows the source potential to be connected to the PCB over the thermal pad which offers several advantages, such as increased thermal capability, advanced power density or improved layout possibilities. It also have the reduced active cooling requirements and the effective layout for thermal management which are benefits at the system level.
Enabling highest power density and performance
Superior thermal performance
Optimized layout possibilities
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