Infineon CoolSiC Type N-Channel MOSFET, 103 A, 650 V Enhancement, 4-Pin PG-TO247-4 IMZA65R015M2HXKSA1
- RS-stocknr.:
- 349-334
- Fabrikantnummer:
- IMZA65R015M2HXKSA1
- Fabrikant:
- Infineon
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- Plus verzending 19 stuk(s) vanaf 10 augustus 2026
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*prijsindicatie
- RS-stocknr.:
- 349-334
- Fabrikantnummer:
- IMZA65R015M2HXKSA1
- Fabrikant:
- Infineon
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Infineon | |
| Product Type | MOSFET | |
| Channel Type | Type N | |
| Maximum Continuous Drain Current Id | 103A | |
| Maximum Drain Source Voltage Vds | 650V | |
| Series | CoolSiC | |
| Package Type | PG-TO247-4 | |
| Mount Type | Through Hole | |
| Pin Count | 4 | |
| Maximum Drain Source Resistance Rds | 18mΩ | |
| Channel Mode | Enhancement | |
| Minimum Operating Temperature | -55°C | |
| Typical Gate Charge Qg @ Vgs | 79nC | |
| Maximum Power Dissipation Pd | 341W | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | RoHS | |
| Automotive Standard | No | |
| Alles selecteren | ||
|---|---|---|
Merk Infineon | ||
Product Type MOSFET | ||
Channel Type Type N | ||
Maximum Continuous Drain Current Id 103A | ||
Maximum Drain Source Voltage Vds 650V | ||
Series CoolSiC | ||
Package Type PG-TO247-4 | ||
Mount Type Through Hole | ||
Pin Count 4 | ||
Maximum Drain Source Resistance Rds 18mΩ | ||
Channel Mode Enhancement | ||
Minimum Operating Temperature -55°C | ||
Typical Gate Charge Qg @ Vgs 79nC | ||
Maximum Power Dissipation Pd 341W | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals RoHS | ||
Automotive Standard No | ||
Infineon CoolSiC Series MOSFET, 650V Drain Source Voltage, 103A Continuous Drain Current - IMZA65R015M2HXKSA1
This MOSFET is a silicon carbide power transistor designed for high-voltage switching in demanding industrial environments. It operates as an N-channel enhancement device and is supplied in a four-pin PG-TO247-4 through-hole package suited to heat-sinking and conventional assembly methods. The component supports continuous high-current operation and is specified for wide-temperature use, making it appropriate for systems requiring sustained power handling at elevated junction temperatures.
Features and Benefits:
• 650V drain voltage enables high-voltage switching applications
• 103A continuous drain current supports heavy current loads
• 18 mΩ RDS(on) reduces conduction losses for higher efficiency
• 79 nC typical gate charge affords predictable switching behaviour
• 341W maximum power dissipation allows substantial thermal loading
• Rated from -55 °C to 175 °C suits extreme-temperature operation
• 103A continuous drain current supports heavy current loads
• 18 mΩ RDS(on) reduces conduction losses for higher efficiency
• 79 nC typical gate charge affords predictable switching behaviour
• 341W maximum power dissipation allows substantial thermal loading
• Rated from -55 °C to 175 °C suits extreme-temperature operation
Applications
• Suitable for industrial motor drive power stages
• Ideal for high-voltage power supplies and inverters
• Used with robust heat-sink assemblies in converters
• Can be used for high-current DC-DC conversion systems
• Appropriate for replacement in through-hole power electronics
• Ideal for high-voltage power supplies and inverters
• Used with robust heat-sink assemblies in converters
• Can be used for high-current DC-DC conversion systems
• Appropriate for replacement in through-hole power electronics
What package and mounting method does it use?
It comes in a PG-TO247-4 package with through-hole mounting for soldered or bolted heat-sink attachment.
How does the gate specification affect switching design?
The typical gate charge of 79 nC indicates gate-drive energy and influences chosen driver strength and switching-speed trade-offs.
What thermal limits should designers consider?
The device can dissipate up to 341W under specified conditions and is rated to operate up to 175 °C for high-temperature system designs.
Is it suitable for automotive standard requirements?
It is not specified as meeting automotive standard approvals and should be assessed against automotive qualification needs.
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