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    TDK 470nF MLCC, 50V dc V, ±10% , SMD

    Bulkkorting beschikbaar

    Prijs Per stuk (in een verpakking 50)**

    € 0,214

    (excl. BTW)

    € 0,259

    (incl. BTW)

    selecteer of typ hoeveelheid
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    * Bezorgdata kunnen veranderen afhankelijk van de gekozen hoeveelheid en het bezorgadres.

    Aantal stuks
    Per stuk
    Per pak**
    50 - 200€ 0,214€ 10,70
    250 - 450€ 0,087€ 4,35
    500 - 950€ 0,077€ 3,85
    1000 - 1950€ 0,069€ 3,45
    2000 +€ 0,064€ 3,20

    **prijsindicatie

    Verpakkingsopties
    RS-stocknr.:
    903-9101
    Fabrikantnummer:
    C2012X7R1H474K125AB
    Fabrikant:
    TDK

    TDK C Type 0805 Series C0G, X6S, X7R, X7S, X7T, X8R, Y5V Dielectric


    TDK C Series of general purpose multilayer ceramic chip capacitors suited for high frequency and high density type power suppliers.

    Features and Benefits:


    High capacitance through precision technologies that enable the use of multiple thinner ceramic dielectric layers
    A monolithic structure ensures superior mechanical strength and reliability
    Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values
    Low self-heating and high ripple resistance due to low ESR

    Applications:


    Commercial Grade for general applications including
    General electronic equipment; Mobile communication equipment; Power supply circuit; Office automation equipment; TV, LED displays; Servers, PCs, Notebooks, Tablets

    Warning

    Not Recommended for New Design


    0805 Range


    Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.