TDK 1nF Multilayer Ceramic Capacitor MLCC, 50V dc V, ±10% , SMD
- RS-stocknr.:
- 179-5576
- Fabrikantnummer:
- CGA3E2X7R1H102K080AE
- Fabrikant:
- TDK
Bulkkorting beschikbaar
Subtotaal (1 rol van 500 eenheden)*
€ 23,00
(excl. BTW)
€ 28,00
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Op voorraad
- 1.500 stuk(s) klaar voor verzending vanaf een andere locatie
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk | Per rol* |
|---|---|---|
| 500 - 1500 | € 0,046 | € 23,00 |
| 2000 + | € 0,042 | € 21,00 |
*prijsindicatie
- RS-stocknr.:
- 179-5576
- Fabrikantnummer:
- CGA3E2X7R1H102K080AE
- Fabrikant:
- TDK
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | TDK | |
| Capacitance | 1nF | |
| Voltage | 50V dc | |
| Package/Case | 0603 (1608M) | |
| Mounting Type | Surface Mount | |
| Dielectric | X7R | |
| Tolerance | ±10% | |
| Dimensions | 1.6 x 0.8 x 0.8mm | |
| Automotive Standard | AEC-Q200 | |
| Length | 1.6mm | |
| Depth | 0.8mm | |
| Height | 0.8mm | |
| Series | CGA | |
| Minimum Operating Temperature | -55°C | |
| Suppression Class | Class 2 | |
| Maximum Operating Temperature | +125°C | |
| Alles selecteren | ||
|---|---|---|
Merk TDK | ||
Capacitance 1nF | ||
Voltage 50V dc | ||
Package/Case 0603 (1608M) | ||
Mounting Type Surface Mount | ||
Dielectric X7R | ||
Tolerance ±10% | ||
Dimensions 1.6 x 0.8 x 0.8mm | ||
Automotive Standard AEC-Q200 | ||
Length 1.6mm | ||
Depth 0.8mm | ||
Height 0.8mm | ||
Series CGA | ||
Minimum Operating Temperature -55°C | ||
Suppression Class Class 2 | ||
Maximum Operating Temperature +125°C | ||
- Land van herkomst:
- JP
TDK multilayer ceramic chip capacitor_Soft termination_Automotive grade_CGA series is a product which conductive resin layers are included in terminations. Soft termination series has higher mechanical endurance by the flexible resin layers which absorbs thermal and mechanical stress.
FEATURES
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key
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