TDK 100nF Multilayer Ceramic Capacitor MLCC, 50V dc V, ±10% , SMD
- RS-stocknr.:
- 179-5571
- Fabrikantnummer:
- CGA4J2X8R1H104K125AD
- Fabrikant:
- TDK
Bulkkorting beschikbaar
Subtotaal (1 verpakking van 10 eenheden)*
€ 1,08
(excl. BTW)
€ 1,31
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Op voorraad
- 600 stuk(s) klaar voor verzending vanaf een andere locatie
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk | Per verpakking* |
|---|---|---|
| 10 - 90 | € 0,108 | € 1,08 |
| 100 - 490 | € 0,101 | € 1,01 |
| 500 - 990 | € 0,049 | € 0,49 |
| 1000 + | € 0,048 | € 0,48 |
*prijsindicatie
- RS-stocknr.:
- 179-5571
- Fabrikantnummer:
- CGA4J2X8R1H104K125AD
- Fabrikant:
- TDK
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | TDK | |
| Capacitance | 100nF | |
| Voltage | 50V dc | |
| Package/Case | 0805 (2012M) | |
| Mounting Type | Surface Mount | |
| Dielectric | X8R | |
| Tolerance | ±10% | |
| Dimensions | 2 x 1.25 x 1.25mm | |
| Automotive Standard | AEC-Q200 | |
| Length | 2mm | |
| Depth | 1.25mm | |
| Height | 1.25mm | |
| Series | CGA | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | +150°C | |
| Suppression Class | Class 2 | |
| Alles selecteren | ||
|---|---|---|
Merk TDK | ||
Capacitance 100nF | ||
Voltage 50V dc | ||
Package/Case 0805 (2012M) | ||
Mounting Type Surface Mount | ||
Dielectric X8R | ||
Tolerance ±10% | ||
Dimensions 2 x 1.25 x 1.25mm | ||
Automotive Standard AEC-Q200 | ||
Length 2mm | ||
Depth 1.25mm | ||
Height 1.25mm | ||
Series CGA | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature +150°C | ||
Suppression Class Class 2 | ||
- Land van herkomst:
- JP
Features
AgPdCu termination for conductive glue mounting
Reduce risk of silver migration
Improved mechanical and thermal strength when use with conductive glue.
Design
Applications
Transmission control
Engine sensor module
Automotive power train ABS
Application requiring conductive glue mounting Method
AgPdCu termination for conductive glue mounting
Reduce risk of silver migration
Improved mechanical and thermal strength when use with conductive glue.
Design
Applications
Transmission control
Engine sensor module
Automotive power train ABS
Application requiring conductive glue mounting Method
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