KEMET 3.3nF Multilayer Ceramic Capacitor MLCC, 25V dc V, ±5% , SMD
- RS-stocknr.:
- 148-159
- Fabrikantnummer:
- C0805C332J3GACTU
- Fabrikant:
- KEMET
Momenteel niet beschikbaar
We weten niet of dit item nog op voorraad komt, RS is van plan dit binnenkort uit ons assortiment te halen.
- RS-stocknr.:
- 148-159
- Fabrikantnummer:
- C0805C332J3GACTU
- Fabrikant:
- KEMET
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | KEMET | |
| Capacitance | 3.3nF | |
| Voltage | 25V dc | |
| Package/Case | 0805 (2012M) | |
| Mounting Type | Surface Mount | |
| Dielectric | C0G | |
| Tolerance | ±5% | |
| Dimensions | 2 x 1.25 x 0.9mm | |
| Length | 2mm | |
| Depth | 1.25mm | |
| Height | 0.9mm | |
| Series | C | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | +125°C | |
| Alles selecteren | ||
|---|---|---|
Merk KEMET | ||
Capacitance 3.3nF | ||
Voltage 25V dc | ||
Package/Case 0805 (2012M) | ||
Mounting Type Surface Mount | ||
Dielectric C0G | ||
Tolerance ±5% | ||
Dimensions 2 x 1.25 x 0.9mm | ||
Length 2mm | ||
Depth 1.25mm | ||
Height 0.9mm | ||
Series C | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature +125°C | ||
KEMET C0805 Series
Surface Mount Multilayer Ceramic Chip Capacitors
Ultra-Stable, Low Loss, Class I capacitor series with Tin (Sn) Termination
Ultra-Stable, Low Loss, Class I capacitor series with Tin (Sn) Termination
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
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