Infineon F475R06W1E3BOMA1 Emitter-Collector, Quad (2 x Dual) IGBT Module, 100 A 600 V
- RS-stocknr.:
- 244-5369
- Fabrikantnummer:
- F475R06W1E3BOMA1
- Fabrikant:
- Infineon
Bulkkorting beschikbaar
Subtotaal (1 tray van 24 eenheden)*
€ 816,528
(excl. BTW)
€ 988,008
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 28 juni 2027
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk | Per tray* |
|---|---|---|
| 24 - 24 | € 34,022 | € 816,53 |
| 48 + | € 32,321 | € 775,70 |
*prijsindicatie
- RS-stocknr.:
- 244-5369
- Fabrikantnummer:
- F475R06W1E3BOMA1
- Fabrikant:
- Infineon
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Infineon | |
| Maximum Continuous Collector Current | 100 A | |
| Maximum Collector Emitter Voltage | 600 V | |
| Maximum Gate Emitter Voltage | +/-20V | |
| Number of Transistors | 4 | |
| Maximum Power Dissipation | 275 W | |
| Configuration | Emitter-Collector, Quad (2 x Dual) | |
| Alles selecteren | ||
|---|---|---|
Merk Infineon | ||
Maximum Continuous Collector Current 100 A | ||
Maximum Collector Emitter Voltage 600 V | ||
Maximum Gate Emitter Voltage +/-20V | ||
Number of Transistors 4 | ||
Maximum Power Dissipation 275 W | ||
Configuration Emitter-Collector, Quad (2 x Dual) | ||
The infineon IGBT module is suitable for auxiliary inverters, UPS systems, inductive heating and welding and solar applications etc.
Electrical features
Low switching losses, low inductive design
Trench IGBT 3
VCEsat with positive temperature coefficient
Low VCEsat
Mechanical features
Al2O3 substrate with low thermal resistance
Compact design
Solder contact technology
Rugged mounting due to integrated mounting clamps
Low switching losses, low inductive design
Trench IGBT 3
VCEsat with positive temperature coefficient
Low VCEsat
Mechanical features
Al2O3 substrate with low thermal resistance
Compact design
Solder contact technology
Rugged mounting due to integrated mounting clamps
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