Infineon FS1150R08A8P3LMCHPSA1 Half Bridge IGBT, 600 A 750 V, Screw Mount
- RS-stocknr.:
- 349-029
- Fabrikantnummer:
- FS1150R08A8P3LMCHPSA1
- Fabrikant:
- Infineon
Subtotaal (1 eenheid)*
€ 1.042,74
(excl. BTW)
€ 1.261,72
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 05 november 2027
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk |
|---|---|
| 1 + | € 1.042,74 |
*prijsindicatie
- RS-stocknr.:
- 349-029
- Fabrikantnummer:
- FS1150R08A8P3LMCHPSA1
- Fabrikant:
- Infineon
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Infineon | |
| Maximum Continuous Collector Current | 600 A | |
| Maximum Collector Emitter Voltage | 750 V | |
| Maximum Gate Emitter Voltage | ±20V | |
| Maximum Power Dissipation | 1 kW | |
| Number of Transistors | 6 | |
| Configuration | Half Bridge | |
| Mounting Type | Screw Mount | |
| Channel Type | N | |
| Alles selecteren | ||
|---|---|---|
Merk Infineon | ||
Maximum Continuous Collector Current 600 A | ||
Maximum Collector Emitter Voltage 750 V | ||
Maximum Gate Emitter Voltage ±20V | ||
Maximum Power Dissipation 1 kW | ||
Number of Transistors 6 | ||
Configuration Half Bridge | ||
Mounting Type Screw Mount | ||
Channel Type N | ||
- Land van herkomst:
- DE
The Infineon HybridPACK Drive G2 module is a very compact six pack power module with enhanced package optimized for hybrid and electric vehicles. The power module implements Infineons next generation chip technology EDT3 750V, optimized for electric drive train applications, from mid to high range automotive power classes.
Low inductive design
4.2 kV DC 1 second insulation
High creepage and clearance distances
Direct cooled PinFin base plate
PCB and cooler assembly guidelines
PressFIT contact technology
4.2 kV DC 1 second insulation
High creepage and clearance distances
Direct cooled PinFin base plate
PCB and cooler assembly guidelines
PressFIT contact technology
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