Winslow Straight Through Hole Mount 1.27 mm, 2.54 mm Pitch IC Socket Adapter, 44 Pin Female SOP to 44 Pin Male DIP
- RS-stocknr.:
- 741-9442
- Fabrikantnummer:
- W9521RC
- Fabrikant:
- Winslow
Afbeelding representeert productcategorie
Bulkkorting beschikbaar
Subtotaal (1 eenheid)*
€ 46,75
(excl. BTW)
€ 56,57
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Op voorraad
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Aantal stuks | Per stuk |
|---|---|
| 1 - 24 | € 46,75 |
| 25 - 74 | € 42,08 |
| 75 - 199 | € 37,41 |
| 200 - 399 | € 32,72 |
| 400 + | € 30,38 |
*prijsindicatie
- RS-stocknr.:
- 741-9442
- Fabrikantnummer:
- W9521RC
- Fabrikant:
- Winslow
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Winslow | |
| Pitch | 1.27 mm, 2.54 mm | |
| End 1 | 44 Pin Female SOP | |
| End 2 | 44 Pin Male DIP | |
| End 1 Number of Contacts | 44 | |
| End 2 Number of Contacts | 44 | |
| End 1 Type | SOP | |
| End 2 Type | DIP | |
| End 1 Gender | Female | |
| End 2 Gender | Male | |
| Mounting Type | Through Hole | |
| Body Orientation | Straight | |
| Contact Material | Brass | |
| Contact Plating | Tin over Nickel | |
| Housing Material | FR4 | |
| Alles selecteren | ||
|---|---|---|
Merk Winslow | ||
Pitch 1.27 mm, 2.54 mm | ||
End 1 44 Pin Female SOP | ||
End 2 44 Pin Male DIP | ||
End 1 Number of Contacts 44 | ||
End 2 Number of Contacts 44 | ||
End 1 Type SOP | ||
End 2 Type DIP | ||
End 1 Gender Female | ||
End 2 Gender Male | ||
Mounting Type Through Hole | ||
Body Orientation Straight | ||
Contact Material Brass | ||
Contact Plating Tin over Nickel | ||
Housing Material FR4 | ||
- Land van herkomst:
- GB
SOIC to DIP Sockets
Adaptics’ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
PCB: Epoxy Fibreglass FR4
IC Sockets-Package Adaptics DIP
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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