Winslow Straight Through Hole Mount 0.5 mm, 2.54 mm Pitch IC Socket Adapter, TSSOP 48 to DIP 48
- RS-stocknr.:
- 741-9451
- Fabrikantnummer:
- W9574RC
- Fabrikant:
- Winslow
Afbeelding representeert productcategorie
Bulkkorting beschikbaar
Subtotaal (1 eenheid)*
€ 35,65
(excl. BTW)
€ 43,14
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Op voorraad
- Plus verzending 9 stuk(s) vanaf 15 december 2025
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Aantal stuks | Per stuk |
|---|---|
| 1 - 9 | € 35,65 |
| 10 - 24 | € 30,30 |
| 25 - 49 | € 28,52 |
| 50 - 99 | € 26,74 |
| 100 + | € 24,95 |
*prijsindicatie
- RS-stocknr.:
- 741-9451
- Fabrikantnummer:
- W9574RC
- Fabrikant:
- Winslow
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Winslow | |
| Pitch | 0.5 mm, 2.54 mm | |
| End 1 | TSSOP 48 | |
| End 2 | DIP 48 | |
| End 1 Number of Contacts | 48 | |
| End 2 Number of Contacts | 48 | |
| End 1 Type | TSSOP | |
| End 2 Type | DIP | |
| End 1 Gender | Female | |
| End 2 Gender | Male | |
| Mounting Type | Through Hole | |
| Body Orientation | Straight | |
| Contact Material | Brass | |
| Contact Plating | Tin over Nickel | |
| Housing Material | FR4 | |
| Alles selecteren | ||
|---|---|---|
Merk Winslow | ||
Pitch 0.5 mm, 2.54 mm | ||
End 1 TSSOP 48 | ||
End 2 DIP 48 | ||
End 1 Number of Contacts 48 | ||
End 2 Number of Contacts 48 | ||
End 1 Type TSSOP | ||
End 2 Type DIP | ||
End 1 Gender Female | ||
End 2 Gender Male | ||
Mounting Type Through Hole | ||
Body Orientation Straight | ||
Contact Material Brass | ||
Contact Plating Tin over Nickel | ||
Housing Material FR4 | ||
- Land van herkomst:
- GB
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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