Okdo RM117-D1E16W0 ROCK SBC Board 1 GB

The OKdo ROCK 3 Compute Module SODIMM (CM3S) Model A is a highly impressive device that offers an array of features within its compact design. It’s based on the Rockchip RK3566 System on Chip (SoC), which boasts a robust CPU, a Power Management Unit (PMU), DRAM memory, eMMC storage. All these components are packed into a compact DDR2 SODIMM form factor, measuring just 67.6mm x 32mm.

The CM3S is a cost-effective, and highly versatile solution for a wide range of applications. Despite its small size, this device is a true powerhouse. This variant offers 1GB of LPDDR4 RAM and a 16GB eMMC storage configuration. ;The CM3S accelerates product development by providing a powerful SoM in a compact form factor. With a simple carrier board (a 2-layer baseboard is sufficient to provide access to all functions of the SoM), engineers can rapidly develop solutions and prepare the boards for production.;Please note: The images above show a CM3S-specific model. This model has certain features like wireless communication capabilities or eMMC. Depending on the purchased SKU there might be variations to the populated components.

CPU: Quad‑core Arm® Cortex®‑A55 (ARMv8) 64‑bit @ 1.6GHz ;GPU: Arm Mali™‑G52‑2EE, OpenGL® ES1.1/2.0/3.0/3.1/3.2, Vulkan® 1.1, OpenCL™ 2.1 ;NPU: 0.8 TOPs@INT8, support INT8, INT16, FP16, BFP16, support deep learning frameworks such as TensorFlow, Caffe, Tflite, Pytorch, Onnx, Android™ NN, etc ;Memory: 32bit LPDDR4X 1GB ;Storage: eMMC 5.1 16GB;Display: Single display engine, HDMI2.0, Dual MIPI‑DSI ;Multi‑Media: 4K H.265/H.264/VP9 video decoder and 1080p@60fps H.264/H.265 video encoder ;Video input: 8M Pixel ISP and 1 x 4 lanes or 2 x 2 lanes MIPI CSI‑2 and DVP interface ;Audio interface: I2S0/I2S1 with 8 channels, IS2/I2S3 with 2 channels ;High-Speed Interface: One SATA 3.0/PCIe 2.1 combo port, and one USB 2.0 OTG ;Security: Arm TrustZone® security extension, Secure Video Path, Secure JTAG to de-bug, Secure boot, OTP and Crypto (AES/TDES/SM4/SM3/SHA256/SHA512/RSA)

up to 5 x I2C;up to 3 x SPI ;up to 8 x UART ;up to 12 x PWM ;up to 60x GPIO ;1 x ADC ;2 x I2S ;1 x PCIe 2.0, 1 lane host (5Gbps) ;1 x SATA 3.0(shared with PCIe) ;1 x USB 2.0 OTG ;1 x SDIO 3.0 ;1 x HDMI up to 4K x 2k@60Hz ;2 x 2 lane or 1 x 4 lane MIPI CSI camera port ;1 x MIPI DSI 2 lane @ 1.6Gbps per lane ;1 x MIPI DSI 4 lane @ 1.6Gbps per lane ;3.3V ∼ 5V power input ;260 pins SODIMM golden finger edge connector

OKdo has manufacturing capabilities and technical engineering consultants to support long-term stock availability and design longevity. If you would like to collaborate on your next project, let’s design the future together: contact sales@okdo.com