Infineon S27KS0641DPBHI020, SDRAM 64Mbit Surface Mount, 333Mbit/s, 24-Pin FBGA
- RS-stocknr.:
- 181-8267
- Fabrikantnummer:
- S27KS0641DPBHI020
- Fabrikant:
- Infineon
Informatie over voorraden is momenteel niet toegankelijk
- RS-stocknr.:
- 181-8267
- Fabrikantnummer:
- S27KS0641DPBHI020
- Fabrikant:
- Infineon
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Infineon | |
| Memory Size | 64Mbit | |
| Organisation | 8M x 8 bit | |
| Data Rate | 333Mbit/s | |
| Data Bus Width | 8bit | |
| Number of Bits per Word | 8bit | |
| Maximum Random Access Time | 36ns | |
| Number of Words | 8M | |
| Mounting Type | Surface Mount | |
| Package Type | FBGA | |
| Pin Count | 24 | |
| Dimensions | 8 x 6 x 0.8mm | |
| Height | 0.8mm | |
| Length | 8mm | |
| Maximum Operating Temperature | +85 °C | |
| Maximum Operating Supply Voltage | 1.95 V | |
| Width | 6mm | |
| Minimum Operating Supply Voltage | 1.7 V | |
| Minimum Operating Temperature | -40 °C | |
| Alles selecteren | ||
|---|---|---|
Merk Infineon | ||
Memory Size 64Mbit | ||
Organisation 8M x 8 bit | ||
Data Rate 333Mbit/s | ||
Data Bus Width 8bit | ||
Number of Bits per Word 8bit | ||
Maximum Random Access Time 36ns | ||
Number of Words 8M | ||
Mounting Type Surface Mount | ||
Package Type FBGA | ||
Pin Count 24 | ||
Dimensions 8 x 6 x 0.8mm | ||
Height 0.8mm | ||
Length 8mm | ||
Maximum Operating Temperature +85 °C | ||
Maximum Operating Supply Voltage 1.95 V | ||
Width 6mm | ||
Minimum Operating Supply Voltage 1.7 V | ||
Minimum Operating Temperature -40 °C | ||
3.0 V I/O, 11 bus signals
Single ended clock (CK)
1.8 V I/O, 12 bus signals
Differential clock (CK, CK#)
Chip Select (CS#)
8-bit data bus (DQ[7:0])
Read-Write Data Strobe (RWDS)
Bidirectional Data Strobe / Mask
Output at the start of all transactions to indicate refresh latency
Output during read transactions as Read Data Strobe
Input during write transactions as Write Data Mask
RWDS DCARS Timing
During read transactions RWDS is offset by a second clock, phase shifted from CK
The Phase Shifted Clock is used to move the RWDS transition edge within the read data eye
Up to 333 MBps
Double-Data Rate (DDR) - two data transfers per clock
166 MHz clock rate (333 MBps) at 1.8 V VCC
100 MHz clock rate (200 MBps) at 3.0 V VCC
Sequential burst transactions
Configurable Burst Characteristics
Wrapped burst lengths:
16 bytes (8 clocks)
32 bytes (16 clocks)
64 bytes (32 clocks)
128 bytes (64 clocks)
Linear burst
Hybrid option - one wrapped burst followed by linear burst
Wrapped or linear burst type selected in each transaction
Configurable output drive strength
Low Power Modes
Deep Power Down
Package
24-ball FBGA
Single ended clock (CK)
1.8 V I/O, 12 bus signals
Differential clock (CK, CK#)
Chip Select (CS#)
8-bit data bus (DQ[7:0])
Read-Write Data Strobe (RWDS)
Bidirectional Data Strobe / Mask
Output at the start of all transactions to indicate refresh latency
Output during read transactions as Read Data Strobe
Input during write transactions as Write Data Mask
RWDS DCARS Timing
During read transactions RWDS is offset by a second clock, phase shifted from CK
The Phase Shifted Clock is used to move the RWDS transition edge within the read data eye
Up to 333 MBps
Double-Data Rate (DDR) - two data transfers per clock
166 MHz clock rate (333 MBps) at 1.8 V VCC
100 MHz clock rate (200 MBps) at 3.0 V VCC
Sequential burst transactions
Configurable Burst Characteristics
Wrapped burst lengths:
16 bytes (8 clocks)
32 bytes (16 clocks)
64 bytes (32 clocks)
128 bytes (64 clocks)
Linear burst
Hybrid option - one wrapped burst followed by linear burst
Wrapped or linear burst type selected in each transaction
Configurable output drive strength
Low Power Modes
Deep Power Down
Package
24-ball FBGA
