MG Chemicals 832C-375ML Epoxy Resin Adhesive, 375 ml
- RS-stocknr.:
- 918-4986
- Fabrikantnummer:
- 832C-375ML
- Fabrikant:
- MG Chemicals
Bulkkorting beschikbaar
Subtotaal (1 eenheid)*
€ 41,24
(excl. BTW)
€ 49,90
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 90,00
Op voorraad
- Plus verzending 18 stuk(s) vanaf 27 april 2026
- Plus verzending 59 stuk(s) vanaf 27 april 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk |
|---|---|
| 1 - 5 | € 41,24 |
| 6 - 14 | € 39,59 |
| 15 + | € 38,76 |
*prijsindicatie
- RS-stocknr.:
- 918-4986
- Fabrikantnummer:
- 832C-375ML
- Fabrikant:
- MG Chemicals
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | MG Chemicals | |
| Product Type | Epoxy Resin Adhesive | |
| Standards/Approvals | No | |
| Package Size | 375 ml | |
| Alles selecteren | ||
|---|---|---|
Merk MG Chemicals | ||
Product Type Epoxy Resin Adhesive | ||
Standards/Approvals No | ||
Package Size 375 ml | ||
- Land van herkomst:
- CA
MG Chemicals Epoxy Potting Compounds
The MG Chemicals two-part epoxy potting compound has been designed to protect your electronic components. The liquid electric grade 832 series epoxy protects your components against static discharges, fungus, thermal shocks, mechanical impact and vibrations.
Feature and Benefits
Impact resistant
Non-conductive
Low toxicity
Improves reliability and operational range
Non-porous, water and chemical resistant
Hard to remove
Available in different colours
Typical Applications
Aviation Industry
Communication Industry
Marine Industry
Car industry
Potting Compounds
The Potting Compounds are pourable two-part compounds for potting and encapsulating electronic circuits and components. They protect against moisture and corrosion and improve insulation resistance and mechanical strength. They may be cured at room temperature, or oven cured. Use silicone oil aerosol as a mould release agent. Full instructions supplied with each pack.
Note
Refer to the datasheet for more details on how to apply and applications
Caution
Due to exothermic reaction, heat cure temperatures should be at least 25% below the maximum temperature tolerated by the most fragile PCB component. For larger potting blocks, reduce heat cure temperature by greater margins