Molex PCB Header 8-Position, 53988-0619
- RS-stocknr.:
- 520-592
- Fabrikantnummer:
- 53988-0619
- Fabrikant:
- Molex
Subtotaal (1 verpakking van 30 eenheden)*
€ 185,82
(excl. BTW)
€ 224,84
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 26 januari 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Verpakking(en) | Per verpakking | Per stuk* |
|---|---|---|
| 1 + | € 185,82 | € 6,194 |
*prijsindicatie
- RS-stocknr.:
- 520-592
- Fabrikantnummer:
- 53988-0619
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Type | PCB Header | |
| Body Orientation | Vertical | |
| Number of Contacts | 8 | |
| Contact Material | Tin | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Type PCB Header | ||
Body Orientation Vertical | ||
Number of Contacts 8 | ||
Contact Material Tin | ||
- Land van herkomst:
- JP
The TE Connectivity C-Grid header represents innovative design and engineering excellence, ideal for high-temperature applications. Crafted with precision, this high-performance component features a dual-row, through-hole configuration that simplifies PCB integration while ensuring reliable signal transmission. With eight circuits, it is designed for versatility in various wire-to-board applications. The header's tin plating enhances conductivity and durability, making it a dependable choice for PCB headers and receptacles. Its high-temperature thermoplastic construction guarantees resilience under challenging operational conditions, while the thoughtful design allows for secure and faultless mating with compatible parts. Experience confidence in your connectivity with this robust solution, engineered to meet the rigorous demands of modern electronic systems.
Dual-row configuration enhances space efficiency on PCBs
Constructed from high-temperature materials for reliability
Tin plating provides superior conductivity and corrosion resistance
Designed for ease of assembly in various applications
Fully shrouded design ensures secure mating and protection against misalignment
Compliant with industry standards, ensuring a reliable connection
Lightweight construction optimises overall designs without compromising strength
Offers flexibility for a variety of signal and power needs
Constructed from high-temperature materials for reliability
Tin plating provides superior conductivity and corrosion resistance
Designed for ease of assembly in various applications
Fully shrouded design ensures secure mating and protection against misalignment
Compliant with industry standards, ensuring a reliable connection
Lightweight construction optimises overall designs without compromising strength
Offers flexibility for a variety of signal and power needs
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