TE Connectivity Pluggable I/O Connector ZSFP+ Cage Assembly Solder 12 Port 240-Position, 1-2198339-7

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RS-stocknr.:
467-782
Artikelnummer Distrelec:
304-54-973
Fabrikantnummer:
1-2198339-7
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Sub Type

Cage Assembly

Termination Type

Solder

Product Type

Pluggable I/O Connector

Form Factor

ZSFP+

Number of Ports

12

Number of Contacts

240

Contact Material

Gold over Nickel

Contact Plating

Gold Flash over Nickel

Housing Material

Silver Nickel Alloy

Series

SFP28

Standards/Approvals

China RoHS 2000 Directive MIIT Order No 53, EU RoHS Directive 999/2011/EU Compliant, EU REACH Regulation (EC) No. 2/32, 999, EU ELV Directive 65/999/EC Compliant, UL 94V-0

Land van herkomst:
CN
The TE Connectivity zSFP+ Stacked (SFP28) Cage Assembly with Integrated Connector is expertly designed for high-performance signal applications. Incorporating a 0.8mm centreline, this cage assembly facilitates efficient data transmission at a maximum data rate of 32 Gb/s, making it ideal for pluggable I/O applications. Its stacked configuration not only enhances space utilisation but also ensures compatibility with thermally enhanced heat sinks. Crafted from durable nickel silver alloy, this assembly offers reliable performance across a wide operating temperature range of -55 to 105 °C. The thoughtful design incorporates a standard lightpipe style, enhancing visibility, while the integrated termination method promotes ease of installation and reliability for signal circuits. Whether for current or future networking needs, this cage assembly demonstrates a commitment to cutting-edge engineering.

Optimised design enhances spatial efficiency in high-density environments

Durable construction ensures long-lasting performance and reliability

Supports a wide operating temperature range for versatile application

Standard lightpipe style provides improved visibility in operational settings

Integrated connectors streamline installation processes for end-users

Compatible with various pluggable I/O applications, offering flexibility

Well-suited for thermally enhanced environments, promoting stability

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