TE Connectivity QSFP Cage Assembly, 2170754-3
- RS-stocknr.:
- 467-562
- Fabrikantnummer:
- 2170754-3
- Fabrikant:
- TE Connectivity
Subtotaal (1 tray van 8 eenheden)*
€ 188,70
(excl. BTW)
€ 228,33
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 30 januari 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Tray(s) | Per tray | Per stuk* |
|---|---|---|
| 1 + | € 188,70 | € 23,588 |
*prijsindicatie
- RS-stocknr.:
- 467-562
- Fabrikantnummer:
- 2170754-3
- Fabrikant:
- TE Connectivity
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | TE Connectivity | |
| Form Factor | QSFP | |
| Type | Cage Assembly | |
| Number of Ports | 1 | |
| Body Orientation | Straight | |
| Contact Material | Tin | |
| Alles selecteren | ||
|---|---|---|
Merk TE Connectivity | ||
Form Factor QSFP | ||
Type Cage Assembly | ||
Number of Ports 1 | ||
Body Orientation Straight | ||
Contact Material Tin | ||
- Land van herkomst:
- CN
The TE Connectivity Cage Assembly is a robust and versatile interconnect solution designed to meet the demanding needs of modern networking applications. This innovative product combines performance with reliability, supporting data rates of up to 28 Gb/s while maintaining an impressive operating temperature range of -40 to 85 °C. Its sealable design ensures optimal protection against environmental elements, making it ideal for use in various settings. The cage assembly is crafted from high-quality nickel silver, complemented by an anodised black heat sink, enhancing both performance and durability. With its compact form factor and efficient layout, this device facilitates seamless integration within existing infrastructures, advancing your connectivity strategy through reliable pluggable I/O solutions.
Ganged cage type allows for efficient use of space
Heat sink included to ensure optimal thermal performance
Designed specifically for signal applications to enhance connectivity
Compatible with SFP+ stacked configurations for versatile deployment
Elastomeric gasket provides EMI containment for improved reliability
Box and tray packaging method ensures safe delivery and handling
Recommended PCB thickness simplifies setup and installation
Heat sink included to ensure optimal thermal performance
Designed specifically for signal applications to enhance connectivity
Compatible with SFP+ stacked configurations for versatile deployment
Elastomeric gasket provides EMI containment for improved reliability
Box and tray packaging method ensures safe delivery and handling
Recommended PCB thickness simplifies setup and installation
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