Samtec SEAF Series Straight Surface Mount PCB Socket, 160-Contact, 8-Row, 1.27mm Pitch, Solder Termination
- RS-stocknr.:
- 767-8956
- Fabrikantnummer:
- SEAF-20-05.0-S-08-2-A-K-TR
- Fabrikant:
- Samtec
Bulkkorting beschikbaar
Subtotaal (1 eenheid)*
€ 16,36
(excl. BTW)
€ 19,80
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Op voorraad
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Aantal stuks | Per stuk |
|---|---|
| 1 - 19 | € 16,36 |
| 20 - 74 | € 13,59 |
| 75 - 299 | € 12,17 |
| 300 - 599 | € 11,86 |
| 600 + | € 11,56 |
*prijsindicatie
- RS-stocknr.:
- 767-8956
- Fabrikantnummer:
- SEAF-20-05.0-S-08-2-A-K-TR
- Fabrikant:
- Samtec
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Samtec | |
| Number of Contacts | 160 | |
| Number of Rows | 8 | |
| Pitch | 1.27mm | |
| Type | Board to Board | |
| Mounting Type | Surface Mount | |
| Body Orientation | Straight | |
| Termination Method | Solder | |
| Current Rating | 2.3A | |
| Voltage Rating | 240 V | |
| Series | SEAF | |
| Contact Material | Copper | |
| Alles selecteren | ||
|---|---|---|
Merk Samtec | ||
Number of Contacts 160 | ||
Number of Rows 8 | ||
Pitch 1.27mm | ||
Type Board to Board | ||
Mounting Type Surface Mount | ||
Body Orientation Straight | ||
Termination Method Solder | ||
Current Rating 2.3A | ||
Voltage Rating 240 V | ||
Series SEAF | ||
Contact Material Copper | ||
1.27mm SEARAY™ Series Interconnects
SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.
Various rows high density connectors suitable for board stacking applications
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area
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