Molex PMC Mezzanine Series Straight Surface Edge Connector, 64-Contact, 2 Row, 1 mm Pitch Solder
- RS-stocknr.:
- 447-7202
- Artikelnummer Distrelec:
- 303-00-027
- Fabrikantnummer:
- 71439-1164
- Fabrikant:
- Molex
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- RS-stocknr.:
- 447-7202
- Artikelnummer Distrelec:
- 303-00-027
- Fabrikantnummer:
- 71439-1164
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Number of Contacts | 64 | |
| Product Type | Edge Connector | |
| Number of Rows | 2 | |
| Sub Type | Board-to-Board | |
| Current | 12A | |
| Pitch | 1mm | |
| Termination Type | Solder | |
| Housing Material | Thermoplastic | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Connector System | Board-to-Board, Signal | |
| Voltage | 100V | |
| Series | PMC Mezzanine | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 1.4mm | |
| Contact Plating | Gold | |
| Contact Material | Bronze | |
| Maximum Operating Temperature | 85°C | |
| Contact Gender | Female | |
| Standards/Approvals | No | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Number of Contacts 64 | ||
Product Type Edge Connector | ||
Number of Rows 2 | ||
Sub Type Board-to-Board | ||
Current 12A | ||
Pitch 1mm | ||
Termination Type Solder | ||
Housing Material Thermoplastic | ||
Mount Type Surface | ||
Orientation Straight | ||
Connector System Board-to-Board, Signal | ||
Voltage 100V | ||
Series PMC Mezzanine | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 1.4mm | ||
Contact Plating Gold | ||
Contact Material Bronze | ||
Maximum Operating Temperature 85°C | ||
Contact Gender Female | ||
Standards/Approvals No | ||
- Land van herkomst:
- US
Vertical Stacking SMT Headers & Sockets 64 Way
A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Approvals
UL recognised component
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