Samtec ASP Series Straight Surface PCB Socket, 160-Contact, 2 Row, 0.5 mm Pitch Solder
- RS-stocknr.:
- 180-4691
- Fabrikantnummer:
- ASP-122953-01
- Fabrikant:
- Samtec
Momenteel niet beschikbaar
We weten niet of dit item nog op voorraad komt, RS is van plan dit binnenkort uit ons assortiment te halen.
- RS-stocknr.:
- 180-4691
- Fabrikantnummer:
- ASP-122953-01
- Fabrikant:
- Samtec
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Samtec | |
| Product Type | PCB Socket | |
| Number of Contacts | 160 | |
| Number of Rows | 2 | |
| Sub Type | Terminal Assembly | |
| Current | 2.7A | |
| Pitch | 0.5mm | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Connector System | Board-to-Board | |
| Stacking Height | 10mm | |
| Voltage | 339 V | |
| Series | ASP | |
| Row Pitch | 6.18mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Material | Bronze | |
| Contact Plating | Gold over Nickel | |
| Maximum Operating Temperature | 125°C | |
| Contact Gender | Female | |
| Standards/Approvals | RoHS | |
| Alles selecteren | ||
|---|---|---|
Merk Samtec | ||
Product Type PCB Socket | ||
Number of Contacts 160 | ||
Number of Rows 2 | ||
Sub Type Terminal Assembly | ||
Current 2.7A | ||
Pitch 0.5mm | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Straight | ||
Connector System Board-to-Board | ||
Stacking Height 10mm | ||
Voltage 339 V | ||
Series ASP | ||
Row Pitch 6.18mm | ||
Minimum Operating Temperature -55°C | ||
Contact Material Bronze | ||
Contact Plating Gold over Nickel | ||
Maximum Operating Temperature 125°C | ||
Contact Gender Female | ||
Standards/Approvals RoHS | ||
- Land van herkomst:
- CR
Altera® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in today’s FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.
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