Molex 46436 Series Right Angle Through Hole PCB Socket, 30-Contact, 1 Row, 2.54 mm Pitch Through Hole

Subtotaal (1 tray van 20 eenheden)*

€ 267,06

(excl. BTW)

€ 323,14

(incl. BTW)

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  • Klaar voor verzending vanaf 20 juli 2026
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Tray(s)
Per tray
Per stuk*
1 +€ 267,06€ 13,353

*prijsindicatie

RS-stocknr.:
691-483
Fabrikantnummer:
46436-3005
Fabrikant:
Molex
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Merk

Molex

Product Type

PCB Socket

Number of Contacts

30

Number of Rows

1

Sub Type

Socket

Current

55A

Pitch

2.54mm

Termination Type

Through Hole

Housing Material

Liquid Crystal Polymer

Mount Type

Through Hole

Orientation

Right Angle

Connector System

Board-to-Board

Voltage

600V

Series

46436

Minimum Operating Temperature

-40°C

Contact Plating

Gold

Contact Material

Copper

Maximum Operating Temperature

105°C

Standards/Approvals

UL E29179

Land van herkomst:
ID
The Molex EXTreme Ten60Power Right-Angle Receptacle is designed to provide reliable connectivity in demanding applications. With support for 24 signal circuits and 6 power circuits, it serves as a robust solution for board-to-board connections, ensuring optimal power and signal integrity. This receptacle features a right-angle orientation for efficient spacing and integration in Compact designs. Constructed from high-conductivity copper and protected by Durable metal plating, the EXTreme Ten60Power is perfect for applications requiring high performance in challenging environments. Its compliance with industry standards, along with a low-halogen component design, highlights its commitment to safety and environmental responsibility, making it an Ideal choice for modern electronic systems.

Durable construction with high-conductivity copper ensures reliable performance

Low-halogen material promotes environmental compliance and safety

Maximum voltage rating of 600V AC / 250V DC for high-voltage applications

200 mating cycles durability maximises longevity in demanding environments

Compatible with various PCB thicknesses, enhancing design flexibility

Tray Packaging Aids in efficient handling and deployment during assembly

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