Molex Micro-Fit 3.0 Series Right Angle Surface PCB Header, 6 Contact(s), 3 mm Pitch, 2 Row, Shrouded

Bulkkorting beschikbaar

Subtotaal (1 verpakking van 10 eenheden)*

€ 26,42

(excl. BTW)

€ 31,97

(incl. BTW)

Add to Basket
selecteer of typ hoeveelheid
Tijdelijk niet op voorraad
  • Verzending 200 stuk(s) vanaf 15 december 2025
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks
Per stuk
Per verpakking*
10 - 40€ 2,642€ 26,42
50 - 90€ 2,251€ 22,51
100 - 240€ 1,984€ 19,84
250 - 490€ 1,906€ 19,06
500 +€ 1,828€ 18,28

*prijsindicatie

Verpakkingsopties
RS-stocknr.:
688-2754
Fabrikantnummer:
43045-0606
Fabrikant:
Molex
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren

Merk

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Current

5A

Pitch

3mm

Housing Material

Thermoplastic

Number of Contacts

6

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Mount Type

Surface

Connector System

Wire-to-Board

Contact Plating

Tin

Contact Material

Brass

Minimum Operating Temperature

-40°C

Termination Type

Solder

Row Pitch

3mm

Contact Gender

Male

Maximum Operating Temperature

105°C

Standards/Approvals

No

Voltage

250 V

Distrelec Product Id

304-43-600

Land van herkomst:
MX

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Metal Press Fit Retention Clips, 43045 Series


Micro-Fit 3.0 3mm pitch wire to board dual row PCB through hole and SMT headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, metal press-fit retention clips are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Features and Benefits


• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Through hole versions SMT compatible

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Press fit retention clips for PCB retention

• Glow Wire Compliant

Product Application Information


These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals

Molex Micro-Fit 3.0 Series


Gerelateerde Links