Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 6 Contact(s), 3 mm Pitch, 2 Row, Shrouded
- RS-stocknr.:
- 670-0371
- Fabrikantnummer:
- 43045-0614
- Fabrikant:
- Molex
Bulkkorting beschikbaar
Subtotaal (1 verpakking van 5 eenheden)*
€ 12,62
(excl. BTW)
€ 15,27
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Op voorraad
- Plus verzending 25 stuk(s) vanaf 15 december 2025
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Aantal stuks | Per stuk | Per verpakking* |
|---|---|---|
| 5 - 45 | € 2,524 | € 12,62 |
| 50 - 120 | € 2,236 | € 11,18 |
| 125 - 495 | € 1,772 | € 8,86 |
| 500 + | € 1,70 | € 8,50 |
*prijsindicatie
- RS-stocknr.:
- 670-0371
- Fabrikantnummer:
- 43045-0614
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Product Type | PCB Header | |
| Series | Micro-Fit 3.0 | |
| Current | 8.5A | |
| Pitch | 3mm | |
| Number of Contacts | 6 | |
| Housing Material | High Temperature Thermoplastic | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Plating | Gold | |
| Contact Material | Brass | |
| Row Pitch | 3mm | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 125°C | |
| Contact Gender | Male | |
| Standards/Approvals | No | |
| Mating Pin Length | 3mm | |
| Voltage | 600 V | |
| Distrelec Product Id | 304-33-532 | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Product Type PCB Header | ||
Series Micro-Fit 3.0 | ||
Current 8.5A | ||
Pitch 3mm | ||
Number of Contacts 6 | ||
Housing Material High Temperature Thermoplastic | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Plating Gold | ||
Contact Material Brass | ||
Row Pitch 3mm | ||
Termination Type Solder | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 125°C | ||
Contact Gender Male | ||
Standards/Approvals No | ||
Mating Pin Length 3mm | ||
Voltage 600 V | ||
Distrelec Product Id 304-33-532 | ||
- Land van herkomst:
- MX
Molex Micro-Fit 3.0 Series PCB Header, 8.5A Current Rating, 3mm Pitch - 43045-0614
This PCB header is a key component in contemporary electronic applications, designed to ensure reliable connections between wire and board systems. The Micro-Fit 3.0 connector is versatile, allowing for efficient power transfer in a Compact form factor. Its diverse configurations are VITAL for optimising connectivity in high-performance electronic devices.
Features & Benefits
• Glow wire compatibility enhances safety in elevated temperatures
• Dual row configuration simplifies connectivity in constrained spaces
• Durable brass contacts ensure long-lasting performance
Applications
• Used in automation systems for dependable power connections
• Implemented in electrical equipment for secure wire-to-board routing
• Suitable for mechanical devices where space-saving is essential
How does this connector ensure safe operation in high-temperature applications?
The design features a Glow Wire Ignition Temperature (GWIT) of at least 775°C, complying with safety standards for heat resistance, making it suitable for various environments.
What should be considered when selecting a PCB thickness for installation?
For optimal compatibility and secure retention, it is advisable to use a PCB thickness of 1.60mm.
Can it be used with other connector types?
The Micro-Fit 3.0 PCB header is specifically designed to mate with the 43025 Micro-Fit 3.0 receptacle housing, ensuring compatibility within this series.
How many mating cycles can be expected before performance degradation?
This connector is rated for up to 30 mating cycles, indicating its durability and reliability in repeated use.
What is the maximum current rating per contact?
The connector supports a maximum current of 5A per contact, making it suitable for high-current applications while maintaining functionality.
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