Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 2 Row, Shrouded

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€ 9,84

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€ 11,905

(incl. BTW)

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5 - 95€ 1,968€ 9,84
100 - 370€ 1,392€ 6,96
375 - 1495€ 1,336€ 6,68
1500 - 2995€ 1,09€ 5,45
3000 +€ 1,046€ 5,23

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Verpakkingsopties
RS-stocknr.:
670-0321
Fabrikantnummer:
43045-0401
Fabrikant:
Molex
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Merk

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Pitch

3mm

Current

5A

Housing Material

High Temperature Thermoplastic

Number of Contacts

4

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Wire-to-Board

Contact Plating

Gold

Contact Material

Brass

Termination Type

Solder

Row Pitch

3mm

Minimum Operating Temperature

-40°C

Contact Gender

Male

Maximum Operating Temperature

125°C

Standards/Approvals

No

Mating Pin Length

3mm

Voltage

250 V

Distrelec Product Id

304-62-213

Land van herkomst:
MX

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series


Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

Features and Benefits


• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Through hole versions SMT compatible

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Plastic peg PCB locks for secure connection to PCB

• Glow Wire Compliant

Product Application Information


These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals

Molex Micro-Fit 3.0 Series


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