Amphenol Communications Solutions Bergstik Series Through Hole Pin Header, 3 Contact(s), 2.54 mm Pitch, 1 Row,
- RS-stocknr.:
- 236-4634
- Fabrikantnummer:
- 77311-101-03LF
- Fabrikant:
- Amphenol Communications Solutions
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- RS-stocknr.:
- 236-4634
- Fabrikantnummer:
- 77311-101-03LF
- Fabrikant:
- Amphenol Communications Solutions
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Amphenol Communications Solutions | |
| Product Type | Pin Header | |
| Series | Bergstik | |
| Pitch | 2.54mm | |
| Current | 3A | |
| Number of Contacts | 3 | |
| Number of Rows | 1 | |
| Shrouded/Unshrouded | Unshrouded | |
| Mount Type | Through Hole | |
| Contact Material | Phosphor Bronze | |
| Row Pitch | 2.54mm | |
| Termination Type | Solder | |
| Standards/Approvals | No | |
| Alles selecteren | ||
|---|---|---|
Merk Amphenol Communications Solutions | ||
Product Type Pin Header | ||
Series Bergstik | ||
Pitch 2.54mm | ||
Current 3A | ||
Number of Contacts 3 | ||
Number of Rows 1 | ||
Shrouded/Unshrouded Unshrouded | ||
Mount Type Through Hole | ||
Contact Material Phosphor Bronze | ||
Row Pitch 2.54mm | ||
Termination Type Solder | ||
Standards/Approvals No | ||
- Land van herkomst:
- FR
The Amphenol ICC BergStik unshrouded header has 2.54 mm pitch provide board-to-board, wire-to-board and cable-to-board interconnect solutions for all types of electronic equipment and devices.
High temperature thermoplastic material
Reflow compatible
Variable spacing height for stacking headers
Cater to a wide range of applications
Allow dual entry, mating from top or bottom
Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements
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