Molex 43045 Series Straight Through Hole PCB Header, 2 Contact(s), 3 mm Pitch, 1 Row, Shrouded

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€ 7,55

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1500 - 2995€ 0,77€ 3,85
3000 +€ 0,74€ 3,70

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Verpakkingsopties
RS-stocknr.:
233-2933
Fabrikantnummer:
43045-0200
Fabrikant:
Molex
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Merk

Molex

Product Type

PCB Header

Series

43045

Pitch

3mm

Current

8.5A

Number of Contacts

2

Housing Material

Thermoplastic

Number of Rows

1

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Through Hole

Contact Plating

Tin

Contact Material

Brass

Minimum Operating Temperature

-40°C

Row Pitch

3mm

Termination Type

Solder

Maximum Operating Temperature

105°C

Contact Gender

Female

Standards/Approvals

No

Mating Pin Length

3mm

Voltage

600 V

Distrelec Product Id

304-28-468

Molex PCB Header, Tin-Plated Brass Contacts, 3mm Pitch - MicroFit 3.0 Series - 43045-0200


Say hello to streamlined circuits with this PCB header from Molex. It lets you make multiple wire-to-board connections onto a single block. A snap-in plastic peg lock and through-hole mounting make assembly a piece of cake while ensuring the header remains firmly in place during operation. As the unit's fully shrouded, the pins are protected from accidental damage, so will last the duration.

Features & Benefits


• Performs reliably in extreme temperatures between -40°C and +105°C

• Lightweight construction tips the scales at 0.542g, so puts little strain on your PCB

• Tin plating resists corrosion and boosts electrical conductivity

Applications


• Audio systems

• Networking equipment

• Automotive manufacturing

How many mating cycles does this PCB header handle?


The header withstands up to 30 mating cycles. This means you can plug and unplug it from corresponding connectors multiple times without damaging it.

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series


Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

Features and Benefits


• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Through hole versions SMT compatible

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Plastic peg PCB locks for secure connection to PCB

• Glow Wire Compliant

Product Application Information


These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals

Molex Micro-Fit 3.0 Series


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