Samtec SEAM Series Right Angle Surface PCB Header, 320 Contact(s), 1.27 mm Pitch, 8 Row, Shrouded
- RS-stocknr.:
- 224-8304
- Fabrikantnummer:
- SEAM-40-01-L-08-1-RA-TR
- Fabrikant:
- Samtec
Informatie over voorraden is momenteel niet toegankelijk
- RS-stocknr.:
- 224-8304
- Fabrikantnummer:
- SEAM-40-01-L-08-1-RA-TR
- Fabrikant:
- Samtec
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Samtec | |
| Product Type | PCB Header | |
| Series | SEAM | |
| Current | 2.7A | |
| Pitch | 1.27mm | |
| Number of Contacts | 320 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Rows | 8 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface | |
| Connector System | Board-to-Board | |
| Contact Plating | Silver, Tin | |
| Contact Material | Copper Alloy | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 125°C | |
| Contact Gender | Male | |
| Standards/Approvals | No | |
| Voltage | 240 V | |
| Alles selecteren | ||
|---|---|---|
Merk Samtec | ||
Product Type PCB Header | ||
Series SEAM | ||
Current 2.7A | ||
Pitch 1.27mm | ||
Number of Contacts 320 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Rows 8 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface | ||
Connector System Board-to-Board | ||
Contact Plating Silver, Tin | ||
Contact Material Copper Alloy | ||
Minimum Operating Temperature -55°C | ||
Termination Type Solder | ||
Maximum Operating Temperature 125°C | ||
Contact Gender Male | ||
Standards/Approvals No | ||
Voltage 240 V | ||
Niet conform
The Samtec SEARAY SEAM series is an open-pin-field array PCB header which has 1.27 mm pitch. It maximizes design and routing flexibility for single-ended or differential pair configurations, and for power, signal, or ground. It uses the edge rate contact system which is designed for applications requiring high-mating cycles and 56 Gbps PAM4 performance.
Lower insertion/withdrawal forces
Solder charge termination
Maximum grounding & routing flexibility
Stack heights from 7 mm to 18.5 mm
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