TE Connectivity Commercial MATE-N-LOK Series Straight Through Hole PCB Header, 2 Contact(s), 5.08 mm Pitch, 1 Row,

Subtotaal (1 zak van 100 eenheden)*

€ 149,40

(excl. BTW)

€ 180,80

(incl. BTW)

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  • Verzending vanaf 11 mei 2026
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Aantal stuks
Per stuk
Per Zak*
100 +€ 1,494€ 149,40

*prijsindicatie

RS-stocknr.:
164-2789
Fabrikantnummer:
1586530-2
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Series

Commercial MATE-N-LOK

Product Type

PCB Header

Current

13A

Pitch

5.08mm

Number of Contacts

2

Housing Material

Polyamide

Number of Rows

1

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Through Hole

Contact Plating

Gold

Contact Material

Copper Alloy

Termination Type

Solder

Row Pitch

5.08mm

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Tail Pin Length

3.81mm

Contact Gender

Male

Standards/Approvals

No

Voltage

250 V

Land van herkomst:
US

TE Connectivity 5.08 mm Commercial MATE-N-LOK Vertical PCB Header Connectors


Commercial MATE-N-LOK vertical mounting PCB header connectors with a 5.08mm pitch for use in wire to board applications. These Commercial MATE-N-LOK PCB headers are precision moulded to exacting tolerances and have built in contact stabilisation and self-aligning features. The housings are made from nylon and are fully polarized to prevent mis-mating. These Commercial MATE-N-LOK PCB headers feature integral detent lock or positive locking devices which hold the mating connection together under severe conditions of vibration and shock. The contacts have “clean” design without any sharp projections to impede insertion or damage the housings.

Features and Benefits


• Precision moulded to exacting tolerances

• Contact stabilization and self-aligning features

• Polarization to prevent mismating

• Detent and positive locking latches for secure mating connection

• Clean contact design

• Low insertion and extraction force

TE Connectivity Commercial MATE-N-LOK Range


Standards

Headers meet MIL-STD 202 method 208 for solderability

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