Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 1 Row, Shrouded

RS-stocknr.:: 161-7956
Fabrikantnummer:: 43650-0415
Fabrikant:: Molex

Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 1 Row, Shrouded

Subtotaal (1 tray van 2040 eenheden)*

€ 1.748,28

(excl. BTW)

€ 2.115,48

(incl. BTW)

GRATIS bezorging voor bestellingen vanaf € 90,00

Op voorraad

2.040 stuk(s) klaar voor verzending vanaf een andere locatie

Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.

Aantal stuks	Per stuk	Per tray*
2040 +	€ 0,857	€ 1.748,28

*prijsindicatie

RS-stocknr.:: 161-7956
Fabrikantnummer:: 43650-0415
Fabrikant:: Molex

Specificaties

Datasheets

Wetgeving en conformiteit

Productomschrijving

Zoek vergelijkbare producten door een of meer kenmerken te selecteren.

Alles selecteren	Attribuut	Waarde
	Merk	Molex
	Product Type	PCB Header
	Series	Micro-Fit 3.0
	Current	8.5A
	Pitch	3mm
	Number of Contacts	4
	Housing Material	Thermoplastic
	Number of Rows	1
	Orientation	Vertical
	Shrouded/Unshrouded	Shrouded
	Connector System	Wire-to-Board
	Mount Type	Through Hole
	Contact Material	Brass
	Contact Plating	Tin
	Minimum Operating Temperature	-40°C
	Row Pitch	3mm
	Termination Type	Solder
	Contact Gender	Male
	Maximum Operating Temperature	105°C
	Standards/Approvals	No

	Alles selecteren
	Merk Molex
	Product Type PCB Header
	Series Micro-Fit 3.0
	Current 8.5A
	Pitch 3mm
	Number of Contacts 4
	Housing Material Thermoplastic
	Number of Rows 1
	Orientation Vertical
	Shrouded/Unshrouded Shrouded
	Connector System Wire-to-Board
	Mount Type Through Hole
	Contact Material Brass
	Contact Plating Tin
	Minimum Operating Temperature -40°C
	Row Pitch 3mm
	Termination Type Solder
	Contact Gender Male
	Maximum Operating Temperature 105°C
	Standards/Approvals No

Land van herkomst:: US

Molex Micro-Fit 3.0 Series PCB Header, 8.5A Current Rating, 3mm Pitch - 43650-0415

This PCB header facilitates a dependable connection for wire-to-board applications, tailored for high-current situations. The Micro-Fit 3.0 structure features a shrouded design that improves the connector's compatibility and operational stability. With a current rating of 8.5A and a voltage rating of 600V, it meets the requirements of the automation, electronics, and electrical sectors.

Features & Benefits

• Tin plating provides corrosion resistance and conductivity

• Glow wire compliant for safety in elevated temperature environments

• High durability with 30 mating cycles for extended use

Applications

• Utilised in power distribution and control systems

• Suitable for automation equipment needing compact connectors

• Ideal for electronic devices requiring secure wire-to-board connections

What is the recommended PCB thickness for this connector?

The optimal PCB thickness for this connector is 1.60mm, ensuring effective retention and stability during operation.

Can it withstand high temperatures during soldering?

Yes, it can handle a maximum process temperature of 260°C for up to 30 seconds, making it suitable for lead-free solder processes.

How many circuits can this header accommodate?

This header supports up to 4 circuits, offering flexibility for various power and signal connection requirements.

Is it suitable for high-current applications?

Yes, with a maximum current rating of 8.5A per contact, it is appropriate for high-current PCB connections.