Molex 15-91 Series Vertical Surface Header, 14 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded
- RS-stocknr.:
- 817-094
- Fabrikantnummer:
- 15-91-0140
- Fabrikant:
- Molex
Momenteel niet beschikbaar
We weten niet of dit artikel weer voorradig zal zijn, het wordt door de fabrikant stopgezet.
- RS-stocknr.:
- 817-094
- Fabrikantnummer:
- 15-91-0140
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Product Type | Header | |
| Series | 15-91 | |
| Pitch | 2.54mm | |
| Current | 3A | |
| Housing Material | Thermoplastic | |
| Number of Contacts | 14 | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Mount Type | Surface | |
| Connector System | Wire-to-Board | |
| Contact Material | Phosphor Bronze | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Surface Mount | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 120°C | |
| Standards/Approvals | RoHS | |
| Voltage | 250V | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Product Type Header | ||
Series 15-91 | ||
Pitch 2.54mm | ||
Current 3A | ||
Housing Material Thermoplastic | ||
Number of Contacts 14 | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Mount Type Surface | ||
Connector System Wire-to-Board | ||
Contact Material Phosphor Bronze | ||
Contact Plating Gold | ||
Minimum Operating Temperature -40°C | ||
Termination Type Surface Mount | ||
Contact Gender Male | ||
Maximum Operating Temperature 120°C | ||
Standards/Approvals RoHS | ||
Voltage 250V | ||
- Land van herkomst:
- MY
The Molex 2.54mm Pitch C-Grid is a breakaway header is designed for surface mount applications, featuring a dual-row vertical configuration with 14 circuits and selective gold plating for reliable connectivity in electronic assemblies.
Dual-row design allows for efficient space utilisation on PCBs
High-temperature thermoplastic resin contributes to durability
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