Molex 70287 Series Vertical Through Hole Header, 8 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded
- RS-stocknr.:
- 816-953
- Fabrikantnummer:
- 70287-1002
- Fabrikant:
- Molex
Momenteel niet beschikbaar
We weten niet of dit item nog op voorraad komt, RS is van plan dit binnenkort uit ons assortiment te halen.
- RS-stocknr.:
- 816-953
- Fabrikantnummer:
- 70287-1002
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Series | 70287 | |
| Product Type | Header | |
| Current | 3A | |
| Pitch | 2.54mm | |
| Number of Contacts | 8 | |
| Housing Material | High Temperature Thermoplastic | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Material | Brass | |
| Contact Plating | Tin | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Through Hole | |
| Maximum Operating Temperature | 120°C | |
| Contact Gender | Male | |
| Standards/Approvals | RoHS | |
| Voltage | 250V | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Series 70287 | ||
Product Type Header | ||
Current 3A | ||
Pitch 2.54mm | ||
Number of Contacts 8 | ||
Housing Material High Temperature Thermoplastic | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Material Brass | ||
Contact Plating Tin | ||
Minimum Operating Temperature -40°C | ||
Termination Type Through Hole | ||
Maximum Operating Temperature 120°C | ||
Contact Gender Male | ||
Standards/Approvals RoHS | ||
Voltage 250V | ||
- Land van herkomst:
- MY
The Molex PCB header is designed for board-to-board and wire-to-board applications, featuring a 2.54mm pitch for efficient connectivity in Compact spaces. This dual-row connector enhances signal integrity with reliable mating.
Supports a maximum current of 3.0A per contact for efficient power distribution
Built with high-temperature thermoplastic resin for durability in demanding environments
Vertical orientation allows for space-saving designs in electronic assemblies
Designed for through-hole termination interface, ensuring stable connections
Low-halogen per IEC standards, promoting environmental compliance
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