Molex 53048 Series Vertical PCB PCB Header, 5 Contact(s), 1.25 mm Pitch, 1 Row, Shrouded
- RS-stocknr.:
- 814-873
- Fabrikantnummer:
- 53048-1250
- Fabrikant:
- Molex
Subtotaal (1 verpakking van 200 eenheden)*
€ 315,85
(excl. BTW)
€ 382,18
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 90,00
Voorradig bij de fabrikant
- Klaar voor verzending vanaf 16 december 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Verpakking(en) | Per verpakking | Per stuk* |
|---|---|---|
| 1 + | € 315,85 | € 1,579 |
*prijsindicatie
- RS-stocknr.:
- 814-873
- Fabrikantnummer:
- 53048-1250
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Series | 53048 | |
| Product Type | PCB Header | |
| Pitch | 1.25mm | |
| Number of Contacts | 5 | |
| Housing Material | Nylon | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | PCB | |
| Connector System | Wire-to-Board | |
| Contact Plating | Tin | |
| Contact Material | Brass, Phosphor Bronze | |
| Termination Type | Through Hole | |
| Maximum Operating Temperature | 85°C | |
| Contact Gender | Male | |
| Standards/Approvals | UL | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Series 53048 | ||
Product Type PCB Header | ||
Pitch 1.25mm | ||
Number of Contacts 5 | ||
Housing Material Nylon | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type PCB | ||
Connector System Wire-to-Board | ||
Contact Plating Tin | ||
Contact Material Brass, Phosphor Bronze | ||
Termination Type Through Hole | ||
Maximum Operating Temperature 85°C | ||
Contact Gender Male | ||
Standards/Approvals UL | ||
- Land van herkomst:
- JP
The Molex PCB Header is designed for reliable connectivity in various electronic applications, providing exceptional performance and durability in Compact form factors.
Gold plating enhances conductivity and prevents corrosion
Polyamide housing ensures high thermal resistance and durability
Compact design accommodates multiple circuit configurations
Matte tin plating provides a robust alternative for specific applications
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