Molex 203564 Series Vertical Surface PCB Header, 40 Contact(s), 1 mm Pitch, 2 Row, Shrouded
- RS-stocknr.:
- 798-919
- Fabrikantnummer:
- 203564-4017
- Fabrikant:
- Molex
Afbeelding representeert productcategorie
Subtotaal (1 rol van 1100 eenheden)*
€ 4.566,00
(excl. BTW)
€ 5.524,86
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 90,00
Voorradig bij de fabrikant
- Klaar voor verzending vanaf 04 januari 2027
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Rol(len) | Per rol | Per stuk* |
|---|---|---|
| 1 + | € 4.566,00 | € 4,151 |
*prijsindicatie
- RS-stocknr.:
- 798-919
- Fabrikantnummer:
- 203564-4017
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Series | 203564 | |
| Product Type | PCB Header | |
| Pitch | 1mm | |
| Housing Material | Polyamide | |
| Number of Contacts | 40 | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Surface | |
| Contact Material | Bronze | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | -40°C | |
| Row Pitch | 1mm | |
| Termination Type | Surface Mount | |
| Maximum Operating Temperature | 105°C | |
| Voltage | 100V | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Series 203564 | ||
Product Type PCB Header | ||
Pitch 1mm | ||
Housing Material Polyamide | ||
Number of Contacts 40 | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Surface | ||
Contact Material Bronze | ||
Contact Plating Gold | ||
Minimum Operating Temperature -40°C | ||
Row Pitch 1mm | ||
Termination Type Surface Mount | ||
Maximum Operating Temperature 105°C | ||
Voltage 100V | ||
- Land van herkomst:
- MY
The Molex PCB Header is designed for efficient connectivity in electronic applications, featuring a dual-row layout and a secure surface mount configuration.
1.00mm pitch design ensures Compact integration within electronic devices
Dual row configuration allows for higher circuit density
Surface mount style facilitates easy PCB assembly
0.38μm gold plating enhances conductivity and durability
Includes an inner positive lock mechanism for secure connections
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