Molex 3099 Series Vertical Through Hole PCB Header, 8 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- RS-stocknr.:
- 787-520
- Fabrikantnummer:
- 22-15-2086
- Fabrikant:
- Molex
Subtotaal (1 zak van 300 eenheden)*
€ 317,18
(excl. BTW)
€ 383,79
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 90,00
Nieuw product (vandaag reserveren)
- Verzending vanaf 15 oktober 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Zak(ken) | Per Zak | Per stuk* |
|---|---|---|
| 1 + | € 317,18 | € 1,057 |
*prijsindicatie
- RS-stocknr.:
- 787-520
- Fabrikantnummer:
- 22-15-2086
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Series | 3099 | |
| Product Type | PCB Header | |
| Pitch | 2.54mm | |
| Current | 2.5A | |
| Housing Material | Nylon | |
| Number of Contacts | 8 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Material | Brass | |
| Contact Plating | Tin | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -40°C | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 105°C | |
| Voltage | 500V | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Series 3099 | ||
Product Type PCB Header | ||
Pitch 2.54mm | ||
Current 2.5A | ||
Housing Material Nylon | ||
Number of Contacts 8 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Material Brass | ||
Contact Plating Tin | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -40°C | ||
Contact Gender Male | ||
Maximum Operating Temperature 105°C | ||
Voltage 500V | ||
- Land van herkomst:
- MY
The Molex Board Connector provides a High performance Interface for complex PCB assemblies and High density electronic systems. This precision-engineered component facilitates stable signal transmission while its specialized orientation allows for efficient vertical stacking or perpendicular board integration to maximise internal enclosure space.
Features robust construction for enhanced durability in harsh environments
Supports efficient wire-to-board connectivity, optimising space in designs
Compatible with a wide range of configurations to meet diverse application needs
Offers user-friendly engagement to simplify installation and maintenance
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